| Critical evaluation of creep behavior of Sn-Ag-Cu solder alloys over wide range of temperatures A Kanjilal, V Jangid, P Kumar Materials Science and Engineering: A 703, 144-153, 2017 | 15 | 2017 |
| Effect of type of thermo-mechanical excursion on growth of interfacial intermetallic compounds in Cu/Sn-Ag-Cu solder joints R Ghosh, A Kanjilal, P Kumar Microelectronics Reliability 74, 44-51, 2017 | 15 | 2017 |
| Growth of interfacial intermetallic compound layer in diffusion-bonded SAC–Cu solder joints during different types of thermomechanical excursion A Kanjilal, P Kumar Journal of Electronic Materials 47, 457-469, 2018 | 7 | 2018 |
| Effect of Joint Size on Creep Behavior of Sn-Ag-Cu Solder-Cu Joints A Kanjilal, PR Narayanan, M Agilan, P Kumar Journal of Electronic Materials 52 (2), 739-750, 2023 | 2 | 2023 |
| Transition from necking to cavitation driven tertiary creep with length scale in constrained ductile metal joints A Kanjilal, P Kumar Materials Science and Engineering: A 845, 143205, 2022 | 2 | 2022 |
| Size dependent creep deformation of elastically constrained compliant metallic joints A Kanjilal, P Kumar Materialia 21, 101322, 2022 | 2 | 2022 |
| Effects of an interfacial layer on stress relaxation mechanisms active in the Cu–Si thin film system during thermal cycling N Somaiah, A Kanjilal, P Kumar MRS Communications 10 (1), 164-172, 2020 | 1 | 2020 |
| Effect of Length Scale on High Temperature Mechanical Behavior of Sn-Cu Joints: A Mechanics and Material Science Based Treatment A Kanjilal | | 2022 |
| Insights into growth behavior of intermetallic compounds in Sn-Ag-Cu solder joints during mechanical and thermo-mechanical deformation processes A Kanjilal, P Kumar 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), 48-52, 2019 | | 2019 |
Praveen KumarIndian Institute of Science, Bangalore, IndiaVerified email at iisc.ac.in
