| Effect of TiO2 additions on Sn-0.7 Cu-0.05 Ni lead-free composite solder MII Ramli, N Saud, MAAM Salleh, MN Derman, RM Said Microelectronics Reliability 65, 255-264, 2016 | 58 | 2016 |
| Influence of Bi addition on wettability and mechanical properties of Sn-0.7 Cu solder alloy MII Ramli, MSS Yusof, MAA Mohd Salleh, RM Said, K Nogita Solid State Phenomena 273, 27-33, 2018 | 17 | 2018 |
| Effect of TiO2 Reinforcement on Microstructure and Microhardness of Low-Silver SAC107 Lead-Free Solder Composite Solder NM Nasir, N Saud, MNB Derman, AAM Salleh, MII Ramli, RM Said Materials Science Forum 803, 273-277, 2015 | 13 | 2015 |
| Transient liquid phase bonding for solder-a short review N Saud, RM Said IOP Conference Series: Materials Science and Engineering 701 (1), 012050, 2019 | 12 | 2019 |
| Growth kinetic of Sn-0.7 Cu-0.05 Ni solder paste subjected to isothermal aging RM Said, MAA Mohd Salleh, MII Ramli, N Saud Solid State Phenomena 280, 163-168, 2018 | 10 | 2018 |
| Isothermal Aging Affect to the Growth of Sn-Cu-Ni-1 wt.% TiO2 Composite Solder Paste RM Said, MAA Mohd Salleh, MN Derman, MII Ramli, NM Nasir, N Saud Key Engineering Materials 700, 123-131, 2016 | 10 | 2016 |
| Performance of Sn-3.0 Ag-0.5 Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing NSM Zaimi, MAAM Salleh, AV Sandu, MMAB Abdullah, N Saud, ... Materials 14 (4), 776, 2021 | 9 | 2021 |
| Microstructure and growth kinetic study in Sn–Cu transient liquid phase sintering solder paste R Mohd Said, MAA Mohd Salleh, N Saud, MII Ramli, H Yasuda, K Nogita Journal of Materials Science: Materials in Electronics 31, 11077-11094, 2020 | 9 | 2020 |
| Influence of non-metallic particles addition on wettability, intermetallic compound formation and microhardness of Sn-0.7 Cu lead free solder paste NSM Zaimi, MAA Mohd Salleh, AMM Al Bakri, RM Said, N Saud Solid State Phenomena 280, 169-174, 2018 | 9 | 2018 |
| The effect of silicon nitride addition on microstructure and microhardness of SN100C solder alloy using powder metallurgy MII Ramli, N Saud, MAA Mohd Salleh, M Nazree Derman, R Mohd Said, ... Materials Science Forum 803, 228-232, 2015 | 9 | 2015 |
| The effect of Ni and Bi additions on the solderability of Sn-0.7 Cu solder coatings MII Ramli, MAA Mohd Salleh, MMA Abdullah, P Narayanan, J Chaiprapa, ... Journal of Electronic Materials 49, 1-12, 2020 | 8 | 2020 |
| Wettability and Shear Strength of Sn-Cu-Ni-xSi3N4 Composite Solder MII Ramli, MAA Mohd Salleh, MN Derman, RM Said, NM Nasir, N Saud Key Engineering Materials 700, 152-160, 2016 | 8 | 2016 |
| Microstructural Observation and Phase Analysis of Sn-Cu-Ni (SN100C) Lead Free Solder with Addition of Micron-Size Silicon Nitride (Si3N4) Reinforcement MI Izwan Ramli, N Saud, MAA Mohd Salleh, MN Derman, RM Said, ... Applied Mechanics and Materials 754, 518-523, 2015 | 7 | 2015 |
| Effect of surface finish on the wettability and electrical resistivity of Sn-3.0 Ag-0.5 Cu solder SFM Amli, MAAM Salleh, RM Said, NRA Razak, JA Wahab, MII Ramli IOP Conference Series: Materials Science and Engineering 701 (1), 012029, 2019 | 6 | 2019 |
| Effect of TiO2 on the Formation of Primary and Interfacial Cu6Sn5 in Sn-0.7wt%Cu and Sn-0.7wt%Cu-0.05wt%Ni Solder Paste during Soldering MAA Mohd Salleh, RM Said, N Saud, H Yasuda, SD McDonald, K Nogita Key Engineering Materials 700, 161-169, 2016 | 5 | 2016 |
| Influence of 1.5 wt.% Bi on the microstructure, hardness, and shear strength of Sn-0.7 Cu solder joints after isothermal annealing MII Ramli, MAAM Salleh, AV Sandu, SFM Amli, RM Said, N Saud, ... Materials 14 (18), 5134, 2021 | 4 | 2021 |
| Influence of Bismuth in Sn-Based Lead-Free Solder–A Short Review NRA Razak, MAA Mohd Salleh, N Saud, RM Said, MII Ramli Solid State Phenomena 273, 40-45, 2018 | 4 | 2018 |
| Mixed assembly of lead-free solder joint: a short review RM Said, MAAM Salleh, MII Ramli, N Saud, F Somidin, NRA Razak, ... Journal of Physics: Conference Series 2169 (1), 012039, 2022 | 3 | 2022 |
| Effect of Zn Additions on Thermal and Mechanical Properties of Sn-0.7 Cu-xZn Solder Alloy MII Ramli, MAA Mohd Salleh, INA Ibrahim, RM Said Solid State Phenomena 280, 200-205, 2018 | 3 | 2018 |
| Microstructure Evolution of Sn-Cu Based Solder Paste with Different Cu Concentration Subjected to Multiple Reflows RM Said, MAA Mohd Salleh, NAA Amran, MII Ramli Solid State Phenomena 280, 206-211, 2018 | 3 | 2018 |
Mohd Arif Anuar Mohd SallehUniversity Malaysia PerlisVerified email at unimap.edu.my
