Suivre
Belgacem Haba
Belgacem Haba
Autres nomsBel Haba, Berugasemu Haba
Adeia, Google, Tessera, SiPipe, Rambus, NEC, IBM, Stanford University, USTHB
Adresse e-mail validée de alumni.stanford.edu
Titre
Citée par
Citée par
Année
Stacked microelectronic assembly and method therefor
Y Kim, B Haba, V Solberg
US Patent 6,225,688, 2001
3632001
Stacked microelectronic assembly and method therefor
Y Kim, B Haba, V Solberg
US Patent 6,699,730, 2004
3192004
Reconstituted wafer level stacking
B Haba, I Mohammed, V Oganesian, D Ovrutsky, LW Mirkarimi
US Patent 7,901,989, 2011
2622011
Microelectronic elements with post-assembly planarization
V Oganesian, B Haba, C Mitchell, I Mohammed, P Savalia
US Patent 8,847,376, 2014
2512014
Microelectronic packages and methods therefor
B Haba, M Beroz, TG Kang, Y Kubota, S Krishnan, JB Riley III, ...
US Patent 7,453,157, 2008
2432008
Chips having rear contacts connected by through vias to front contacts
B Haba, KA Honer, DB Tuckerman, V Oganesian
US Patent 8,405,196, 2013
2072013
Structure and method of making capped chips having vertical interconnects
G Humpston, D Tuckerman, B McWilliams, B Haba, C Mitchell
US Patent App. 10/949,674, 2005
2052005
Microelectronic packages and methods therefor
B Haba, TG Kang, I Mohammed, E Chau
US Patent 8,058,101, 2011
2032011
Microelectronic elements with rear contacts connected with via first or via middle structures
V Oganesian, B Haba, I Mohammed, C Mitchell, P Savalia
US Patent 8,796,135, 2014
1922014
High-frequency chip packages
M Warner, L Smith, B Haba, G Urbish, M Beroz, TG Kang
US Patent 7,268,426, 2007
1862007
Redistributed bond pads in stacked integrated circuit die package
B Haba, DV Perino, S Khalili
US Patent 6,376,904, 2002
1862002
Microelectronic elements having metallic pads overlying vias
V Oganesian, I Mohammed, C Mitchell, B Haba, P Savalia
US Patent 8,791,575, 2014
1852014
Flexible lead structures and methods of making same
JW Smith, B Haba
US Patent 6,117,694, 2000
1842000
Microelectronic package comprising offset conductive posts on compliant layer
B Haba, M Beroz, G Humpston, JM Park
US Patent 8,207,604, 2012
1822012
Formation of circuitry with modification of feature height
B Haba, M Beroz, YG Kim, DB Tuckerman
US Patent 7,462,936, 2008
1752008
Package-on-package assembly with wire bonds to encapsulation surface
H Sato, TG Kang, B Haba, PR Osborn, WS Wang, E Chau, I Mohammed, ...
US Patent 8,618,659, 2013
1722013
Microelectronic packages and methods therefor
B Haba, M Beroz, R Green, I Mohammed, SE Wilson, W Zohni, Y Kubota, ...
US Patent 7,176,043, 2007
1692007
Wafer-level fabrication of lidded chips with electrodeposited dielectric coating
V Oganesian, D Ovrutsky, C Rosenstein, B Haba, G Humpston
US Patent 7,935,568, 2011
1652011
Direct-connect integrated circuit signaling system for bypassing intra-substrate printed circuit signal paths
JC Fjelstad, PK Segaram, B Haba
US Patent 7,307,293, 2007
1602007
Redistributed bond pads in stacked integrated circuit die package
B Haba, DV Perino, S Khalili
US Patent 6,514,794, 2003
1572003
Le système ne peut pas réaliser cette opération maintenant. Veuillez réessayer plus tard.
Articles 1–20