| An airborne sonar system for underwater remote sensing and imaging A Fitzpatrick, A Singhvi, A Arbabian IEEE Access 8, 189945-189959, 2020 | 49 | 2020 |
| A microwave-induced thermoacoustic imaging system with non-contact ultrasound detection A Singhvi, KC Boyle, M Fallahpour, BT Khuri-Yakub, A Arbabian IEEE transactions on ultrasonics, ferroelectrics, and frequency control 66 …, 2019 | 30 | 2019 |
| Analysis and optimization of programmable delay elements for 2-phase bundled-data circuits G Heck, LS Heck, A Singhvi, MT Moreira, PA Beerel, NLV Calazans 2015 28th international conference on VLSI design, 321-326, 2015 | 24 | 2015 |
| A fine-grained, uniform, energy-efficient delay element for FD-SOI technologies A Singhvi, MT Moreira, RN Tadros, NLV Calazans, PA Beerel 2015 IEEE Computer Society Annual Symposium on VLSI, 27-32, 2015 | 18 | 2015 |
| Resolution enhanced non-contact thermoacoustic imaging using coded pulse excitation A Singhvi, A Fitzpatrick, A Arbabian 2020 IEEE International Ultrasonics Symposium (IUS), 1-4, 2020 | 11 | 2020 |
| Non-contact thermoacoustic sensing and characterization of plant root traits A Singhvi, B Ma, JD Scharwies, JR Dinneny, BT Khuri-Yakub, A Arbabian 2019 IEEE International Ultrasonics Symposium (IUS), 1992-1995, 2019 | 7 | 2019 |
| A fine-grain, uniform, energy-efficient delay element for 2-phase bundled-data circuits A Singhvi, MT Moreira, RN Tadros, NLV Calazans, PA Beerel ACM Journal on Emerging Technologies in Computing Systems (JETC) 13 (2), 1-23, 2016 | 5 | 2016 |
| A thermoacoustic imaging system for noninvasive and nondestructive root phenotyping A Singhvi, A Fitzpatrick, JD Scharwies, JR Dinneny, A Arbabian IEEE Transactions on Circuits and Systems II: Express Briefs 69 (5), 2493-2497, 2022 | 3 | 2022 |
| An Electronically Tunable Multi-Frequency Air-Coupled CMUT Receiver Array with sub-100µPa Minimum Detectable Pressure Achieving a 28kb/s Wireless Uplink Across a Water-Air … A Singhvi, A Fitzpatrick, A Arbabian 2022 IEEE International Solid-State Circuits Conference (ISSCC) 65, 498-500, 2022 | 3 | 2022 |
| EE 214B: Advanced Analog Integrated Circuit Design B Murmann Stanford University, 2012 | 3 | 2012 |
| Multi-modal sensor fusion towards three-dimensional airborne sonar imaging in hydrodynamic conditions A Fitzpatrick, RP Mathews, A Singhvi, A Arbabian Communications Engineering 2 (1), 16, 2023 | 2 | 2023 |
| A W-Band Transceiver Array with 2.4 GHz LO Synchronization Enabling Full Scalability for FMCW Radar J Zhang, A Singhvi, SS Ahmed, A Arbabian 2023 IEEE International Solid-State Circuits Conference (ISSCC), 282-284, 2023 | 2 | 2023 |
| Adaptive beamforming for wireless powering of a network of ultrasonic implants ML Wang, A Singhvi, G Nyikayaramba, B Murmann, A Arbabian 2022 IEEE International Ultrasonics Symposium (IUS), 1-4, 2022 | 2 | 2022 |
| Multi-watt-level 4.9-GHz silicon power amplifier for portable thermoacoustic imaging C Sutardja, A Singhvi, A Fitzpatrick, A Cathelin, A Arbabian IEEE Journal of Solid-State Circuits 57 (5), 1421-1431, 2022 | 2 | 2022 |
| Multi-task learning for simultaneous speed-of-sound mapping and image reconstruction using non-contact thermoacoustics A Singhvi, ML Wang, A Fitzpatrick, A Arbabian 2021 IEEE International Ultrasonics Symposium (IUS), 1-5, 2021 | 2 | 2021 |
| Spatial reconstruction of soil moisture content using non-contact thermoacoustic imaging A Fitzpatrick, A Singhvi, A Arbabian 2020 IEEE SENSORS, 1-4, 2020 | 2 | 2020 |
| Dynamic tuning of sensitivity and bandwidth of high-Q transducers via nested phase modulations A Fitzpatrick, A Singhvi, A Arbabian 2022 IEEE International Symposium on Circuits and Systems (ISCAS), 876-880, 2022 | 1 | 2022 |
| Sensor array with distributed low noise amplifier MS ALIROTEH, NC Warke, DP Magee, A Kiaei, BS Haroun, A Singhvi US Patent 10,879,856, 2020 | 1 | 2020 |
| Three-Dimensional Mapping of Water Surface Waves Using Air-Coupled Sonar A Fitzpatrick, A Singhvi, J Mukania, B Ye, E Giebler, A Arbabian OCEANS 2023-MTS/IEEE US Gulf Coast, 1-7, 2023 | | 2023 |
| Laser Scanning for Single-Shot Frequency Diverse Photoacoustic Excitation WL Meng, A Fitzpatrick, A Singhvi, A Arbabian 2022 IEEE International Ultrasonics Symposium (IUS), 1-4, 2022 | | 2022 |
Amin ArbabianStanford UniversityVerified email at stanford.edu
