| Models for reliability prediction of fine-pitch BGAs and CSPs in shock and drop-impact P Lall, DR Panchagade, Y Liu, RW Johnson, JC Suhling IEEE Transactions on Components and Packaging Technologies 29 (3), 464-474, 2006 | 182 | 2006 |
| Failure-Envelope Approach to Modeling Shock and Vibration Survivability of Electronic and MEMS Packaging P Lall, DR Panchagade, P Choudhary, S Gupte, JC Suhling Components and Packaging Technologies, IEEE Transactions on 31 (1), 104-113, 2008 | 137 | 2008 |
| Smeared-property models for shock-impact reliability of area-array packages P Lall, D Panchagade, Y Liu, W Johnson, J Suhling | 102 | 2007 |
| High speed digital image correlation for transient-shock reliability of electronics P Lall, D Panchagade, D Iyengar, S Shantaram, J Suhling, H Schrier 2007 Proceedings 57th Electronic Components and Technology Conference, 924-939, 2007 | 95 | 2007 |
| Design envelopes and optical feature extraction techniques for survivability of SnAg leadfree packaging architectures under shock and vibration P Lall, D Iyengar, S Shantaram, R Pandher, D Panchagade, J Suhling 2008 58th Electronic Components and Technology Conference, 1036-1047, 2008 | 89 | 2008 |
| Peridynamic-models using finite elements for shock and vibration reliability of leadfree electronics P Lall, S Shantaram, D Panchagade 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2010 | 50 | 2010 |
| Modeling moisture ingress through polyisobutylene‐based edge‐seals MD Kempe, D Panchagade, MO Reese, AA Dameron Progress in Photovoltaics: Research and Applications 23 (5), 570-581, 2015 | 49 | 2015 |
| Ball grid array (BGA) solder joint intermittency detection: SJ BIST JP Hofmeister, P Lall, D Panchagade, NN Roth, TA Tracy, JB Judkins, ... 2008 IEEE Aerospace Conference, 1-11, 2008 | 43 | 2008 |
| Keynote Presentation: Feature extraction and health monitoring using image correlation for survivability of leadfree packaging under shock and vibration P Lall, D Iyengar, SS Shantaram, P Gupta, D Panchagade, J Suhling Proceedings of the 9th International Conference on Thermal, Mechanical, and …, 2008 | 38 | 2008 |
| Fault-mode classification for health monitoring of electronics subjected to drop and shock P Lall, P Gupta, D Panchagade, A Angral 2009 59th Electronic Components and Technology Conference, 668-681, 2009 | 29 | 2009 |
| Digital-image correlation and XFEM based shock-reliability models for leadfree and advanced interconnects P Lall, M Kulkarni, A Angral, D Panchagade, J Suhling 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 28 | 2010 |
| Self-organized mapping of failure modes in portable electronics subjected to drop and shock P Lall, P Gupta, D Panchagade 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 22 | 2010 |
| Life prediction and damage equivalency for shock survivability of electronic components P Lall, D Panchagade, D Iyengar, J Suhling Thermal and Thermomechanical Proceedings 10th Intersociety Conference on …, 2006 | 20 | 2006 |
| Feature extraction and health monitoring using image correlation for survivability of leadfree packaging under shock and vibration P Lall, D Iyengar, S Shantaram, P Gupta, D Panchagade, J Suhling EuroSimE 2008-International Conference on Thermal, Mechanical and Multi …, 2008 | 10 | 2008 |
| Fault-isolation in portable electronics subjected to drop and shock P Lall, P Gupta, D Panchagade, A Angral 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2010 | 9 | 2010 |
| Prognostics and condition monitoring of electronics P Lall, P Gupta, D Panchagade, M Kulkarni, J Suhling, J Hofmeister EuroSimE 2009-10th International Conference on Thermal, Mechanical and Multi …, 2009 | 5 | 2009 |
| Damage Progression Using Speckle‐Correlation and High‐Speed Imaging for Survivability of Leadfree Packaging Under Shock P Lall, D Iyengar, S Shantaram, D Panchagade Strain 45 (3), 267-282, 2009 | 3 | 2009 |
| Prognostication and health monitoring of electronics in implantable biological systems P Lall, P Gupta, M Kulkarni, D Panchagade, J Suhling, J Hofmeister ASME International Mechanical Engineering Congress and Exposition 48630, 657-671, 2008 | 3 | 2008 |
| Development of survivability envelopes for SnAg leadfree packaging architecures under shock and vibration P Lall, D Iyengar, S Shantaram, D Panchagade, J Suhling 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2008 | 2 | 2008 |
| Explicit FE-models and high speed DIC for transient-dynamics of electronics P Lall, D Panchagade, D Iyengar, S Shantaram, J Suhling, H Schrier Proceedings of the 2007 SEM Annual Conference and Exposition on Experimental …, 2007 | 2 | 2007 |
