| Structural characterization of the fullerene nanotubes prepared by the liquid–liquid interfacial precipitation method K Miyazawa, J Minato, T Yoshii, M Fujino, T Suga Journal of Materials Research 20 (3), 688-695, 2005 | 105 | 2005 |
| A combined process of formic acid pretreatment for low-temperature bonding of copper electrodes W Yang, M Akaike, M Fujino, T Suga ECS Journal of Solid State Science and Technology 2 (6), P271, 2013 | 53 | 2013 |
| Silicon carbide wafer bonding by modified surface activated bonding method T Suga, F Mu, M Fujino, Y Takahashi, H Nakazawa, K Iguchi Japanese journal of applied physics 54 (3), 030214, 2015 | 49 | 2015 |
| Combined surface activated bonding technique for low-temperature Cu/dielectric hybrid bonding R He, M Fujino, A Yamauchi, Y Wang, T Suga ECS Journal of Solid State Science and Technology 5 (7), P419, 2016 | 48 | 2016 |
| A comparison study: Direct wafer bonding of SiC–SiC by standard surface-activated bonding and modified surface-activated bonding with Si-containing Ar ion beam F Mu, K Iguchi, H Nakazawa, Y Takahashi, M Fujino, R He, T Suga Applied Physics Express 9 (8), 081302, 2016 | 42 | 2016 |
| Structural investigation of heat-treated fullerene nanotubes and nanowhiskers K Miyazawa, J Minato, M Fujino, T Suga Diamond and related materials 15 (4-8), 1143-1146, 2006 | 39 | 2006 |
| GaN-Si direct wafer bonding at room temperature for thin GaN device transfer after epitaxial lift off F Mu, Y Morino, K Jerchel, M Fujino, T Suga Applied Surface Science 416, 1007-1012, 2017 | 34 | 2017 |
| Transient liquid-phase sintering using silver and tin powder mixture for die bonding M Fujino, H Narusawa, Y Kuramochi, E Higurashi, T Suga, T Shiratori, ... Japanese Journal of Applied Physics 55 (4S), 04EC14, 2016 | 33 | 2016 |
| Room-temperature bonding method for polymer substrate of flexible electronics by surface activation using nano-adhesion layers T Matsumae, M Fujino, T Suga Japanese Journal of Applied Physics 54 (10), 101602, 2015 | 33 | 2015 |
| Room-temperature wafer bonding of SiC–Si by modified surface activated bonding with sputtered Si nanolayer F Mu, K Iguchi, H Nakazawa, Y Takahashi, M Fujino, T Suga Japanese journal of applied physics 55 (4S), 04EC09, 2016 | 29 | 2016 |
| 300 mm wafer-level hybrid bonding for Cu/interlayer dielectric bonding in vacuum M Fujino, K Takahashi, Y Araga, K Kikuchi Japanese Journal of Applied Physics 59 (SB), SBBA02, 2019 | 24 | 2019 |
| Low temperature de-oxidation for copper surface by catalyzed formic acid vapor PW Chou, JM Song, ZY Xie, M Akaike, T Suga, M Fujino, JY Lin Applied Surface Science 456, 890-898, 2018 | 21 | 2018 |
| Reduction reaction analysis of nanoparticle copper oxide for copper direct bonding using formic acid M Fujino, M Akaike, N Matsuoka, T Suga Japanese Journal of Applied Physics 56 (4S), 04CC01, 2017 | 19 | 2017 |
| Direct wafer bonding of SiC-SiC by SAB for monolithic integration of SiC MEMS and electronics F Mu, K Iguchi, H Nakazawa, Y Takahashi, M Fujino, T Suga ECS Journal of Solid State Science and Technology 5 (9), P451, 2016 | 19 | 2016 |
| Room temperature temporary bonding of glass substrates based on SAB method using Si intermediate layer K Takeuchi, M Fujino, T Suga IEEE Transactions on Components, Packaging and Manufacturing Technology 7 …, 2017 | 18 | 2017 |
| Combined surface activated bonding using H-containing HCOOH vapor treatment for Cu/Adhesive hybrid bonding at below 200° C R He, M Fujino, M Akaike, T Sakai, S Sakuyama, T Suga Applied Surface Science 414, 163-170, 2017 | 17 | 2017 |
| Room temperature wafer bonding using surface activated bonding method S Taniyama, YH Wang, M Fujino, T Suga 2008 IEEE 9th VLSI Packaging Workshop of Japan, 141-144, 2008 | 17 | 2008 |
| Combined surface-activated bonding technique for low-temperature hydrophilic direct wafer bonding R He, M Fujino, A Yamauchi, T Suga Japanese Journal of Applied Physics 55 (4S), 04EC02, 2016 | 16 | 2016 |
| Mechanism of bonding and debonding using surface activated bonding method with Si intermediate layer K Takeuchi, M Fujino, Y Matsumoto, T Suga Japanese Journal of Applied Physics 57 (4S), 04FC11, 2018 | 14 | 2018 |
| Fabrication and properties of fullerene nanowhiskers and nanofibers K Miyazawa Trans. Mater. Res. Soc. Jpn. 29, 1965-1968, 2004 | 14 | 2004 |
