Three-dimensional silicon integration JU Knickerbocker, PS Andry, B Dang, RR Horton, MJ Interrante, CS Patel, ... IBM Journal of Research and Development 52 (6), 553-569, 2008 | 556 | 2008 |
Future system-on-silicon LSI chips M Koyanagi, H Kurino, KW Lee, K Sakuma, N Miyakawa, H Itani IEEE micro 18 (4), 17-22, 1998 | 435 | 1998 |
3D silicon integration JU Knickerbocker, PS Andry, B Dang, RR Horton, CS Patel, RJ Polastre, ... 2008 58th Electronic Components and Technology Conference, 538-543, 2008 | 298 | 2008 |
3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections K Sakuma, PS Andry, CK Tsang, SL Wright, B Dang, CS Patel, BC Webb, ... IBM Journal of Research and Development 52 (6), 611-622, 2008 | 199 | 2008 |
Intelligent image sensor chip with three dimensional structure H Kurino, KW Lee, T Nakamura, K Sakuma, KT Park, N Miyakawa, ... International Electron Devices Meeting 1999. Technical Digest (Cat. No …, 1999 | 180 | 1999 |
New three-dimensional wafer bonding technology using the adhesive injection method TMT Matsumoto, MSM Satoh, KSK Sakuma, HKH Kurino, NMN Miyakawa, ... Japanese journal of applied physics 37 (3S), 1217, 1998 | 125 | 1998 |
3D chip stacking technology with low-volume lead-free interconnections K Sakuma, PS Andry, B Dang, J Maria, CK Tsang, C Patel, SL Wright, ... 2007 Proceedings 57th Electronic Components and Technology Conference, 627-632, 2007 | 117 | 2007 |
Development of three-dimensional integration technology for highly parallel image-processing chip KW Lee, TNT Park, HSY Kim, HKH Kurino, MKM Koyanagi Japanese Journal of Applied Physics 39 (4S), 2473, 2000 | 75 | 2000 |
IMC bonding for 3D interconnection K Sakuma, K Sueoka, S Kohara, K Matsumoto, H Noma, T Aoki, Y Oyama, ... 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 74 | 2010 |
Characterization of stacked die using die-to-wafer integration for high yield and throughput K Sakuma, PS Andry, CK Tsang, K Sueoka, Y Oyama, C Patel, B Dang, ... 2008 58th Electronic Components and Technology Conference, 18-23, 2008 | 58 | 2008 |
Heterogeneous integration technology demonstrations for future healthcare, IoT, and AI computing solutions JU Knickerbocker, R Budd, B Dang, Q Chen, E Colgan, LW Hung, ... 2018 IEEE 68th electronic components and technology conference (ECTC), 1519-1528, 2018 | 56 | 2018 |
10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack Y Ohara, A Noriki, K Sakuma, KW Lee, M Murugesan, J Bea, F Yamada, ... 2009 IEEE International Conference on 3D System Integration, 1-6, 2009 | 55 | 2009 |
Experimental thermal resistance evaluation of a three-dimensional (3D) chip stack K Matsumoto, S Ibaraki, K Sueoka, K Sakuma, H Kikuchi, Y Orii, ... 2011 27th Annual IEEE Semiconductor Thermal Measurement and Management …, 2011 | 51* | 2011 |
3D chip stacking with C4 technology B Dang, SL Wright, PS Andry, EJ Sprogis, CK Tsang, MJ Interrante, ... IBM Journal of Research and Development 52 (6), 599-609, 2008 | 48 | 2008 |
Liquid crystal display K Sakuma, Y Sakaguchi US Patent 6,937,233, 2005 | 43 | 2005 |
Structure for establishing interconnects in packages using thin interposers BV Fasano, MS Cranmer, RF Indyk, H Cox, K Sakuma, ED Perfecto US Patent 10,002,835, 2018 | 42 | 2018 |
Wearable nail deformation sensing for behavioral and biomechanical monitoring and human-computer interaction K Sakuma, A Abrami, G Blumrosen, S Lukashov, R Narayanan, ... Scientific reports 8 (1), 18031, 2018 | 37 | 2018 |
An enhanced thermo-compression bonding process to address warpage in 3D integration of large die on organic substrates K Sakuma, K Tunga, B Webb, K Ramachandran, M Interrante, H Liu, ... 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 318-324, 2015 | 37 | 2015 |
Fluxless bonding for fine-pitch and low-volume solder 3-D interconnections K Sakuma, K Toriyama, H Noma, K Sueoka, N Unami, J Mizuno, S Shoji, ... 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 7-13, 2011 | 32 | 2011 |
A new wafer scale chip-on-chip (W-CoC) packaging technology using adhesive injection method H Kurino, KW Lee, K Sakuma, T Nakamura, M Koyanagi Japanese journal of applied physics 38 (4S), 2406, 1999 | 31 | 1999 |