Burnout and job and career satisfaction in the physician assistant profession: a review of the literature AC Essary, KS Bernard, B Coplan, R Dehn, JG Forister, NE Smith, ... NAM Perspectives, 2018 | 46 | 2018 |
Wellness in physician assistant education: exploring mindfulness, well-being, and stress EB Hoover, B Butaney, S LeLacheur, H Straker, K Bernard, B Coplan, ... The Journal of Physician Assistant Education 33 (2), 107-113, 2022 | 8 | 2022 |
Comparing the effectiveness of virtual and in-person delivery of mindfulness-based skills within healthcare curriculums EB Hoover, B Butaney, K Bernard, B Coplan, S LeLacheur, H Straker, ... Medical science educator 32 (3), 627-640, 2022 | 7 | 2022 |
Reading between the lines for a solution to burnout K Bernard, M McMoon JAAPA 32 (9), 48-50, 2019 | 5 | 2019 |
Addressing PA burnout ED Tetzlaff, B Coplan, K Bernard, T Sierra, D Dominguez Jaapa 33 (7), 10-11, 2020 | 3 | 2020 |
Physician assistant burnout and fulfillment related to career development and physician relationship KS Bernard Walden University, 2020 | 3 | 2020 |
Well-being and the early-career PA: Influence of the collaborative physician relationship KS Bernard JAAPA 36 (2), 35-43, 2023 | 2 | 2023 |
Call to Action: multidimensional PA well-being strategies EB Hoover, KS Bernard Physician Assistant Clinics 7 (1), 89-102, 2022 | 2 | 2022 |
Reasons PAs leave their jobs H Reed, K Bernard, N Smith JAAPA 34 (8), 43-47, 2021 | 2 | 2021 |
Impact of COVID-19 on student perceived stress, life satisfaction, and psychological flexibility: examination of gender differences B Butaney, EB Hoover, B Coplan, K Bernard Journal of American College Health, https://doi.org/10.1080/07448481.2023.22, 2023 | | 2023 |
Blueprint for Addressing Physician Assistant Well-being and Burnout: Report of the AAPA Task Force on Burnout E Tetzlaff, K Bernard, H Brown, A Chapman, BH Coplan, D Dominguez, ... American Academy of PAs, 2020 | | 2020 |
Burnout and Job furthermore Career Satisfaction in the Physician Assistant Profession: A Review regarding the Technical AH Essary, KS Bernard, P Coplan, R Dehn, JG Forister, NE Smith | | |