Analysis of stresses and breakage of crystalline silicon wafers during handling and transport XF Brun, SN Melkote Solar energy materials and solar cells 93 (8), 1238-1247, 2009 | 166 | 2009 |
Modeling and prediction of the flow, pressure, and holding force generated by a Bernoulli handling device XF Brun, SN Melkote | 54 | 2009 |
Evaluation of handling stresses applied to EFG silicon wafer using a Bernoulli Gripper XF Brun, SN Melkote 2006 IEEE 4th World Conference on Photovoltaic Energy Conference 2, 1346-1349, 2006 | 25 | 2006 |
A novel design of temporary bond debond adhesive technology for wafer-level assembly D Xu, HW Wang, J Patel, XF Brun, K Hirota, E Capsuto, H Kato, M Sugo 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 68-74, 2020 | 18 | 2020 |
Effect of substrate flexibility on the pressure distribution and lifting force generated by a Bernoulli gripper X Brun, SN Melkote | 16 | 2012 |
Enabling next generation 3D heterogeneous integration architectures on intel process A Elsherbini, K Jun, S Liff, T Talukdar, J Bielefeld, W Li, R Vreeland, ... 2022 International Electron Devices Meeting (IEDM), 27.3. 1-27.3. 4, 2022 | 15 | 2022 |
Electrostatic discharge compliant patterned adhesive tape DD Xu, W Feng, X Brun, S Iyer, A Reichman US Patent App. 13/993,339, 2013 | 14 | 2013 |
Analysis of handling stresses and breakage of thin crystalline silicon wafers XF Brun Georgia Institute of Technology, 2008 | 13 | 2008 |
Modeling and prediction of the flow, pressure and holding force generated by a Bernoulli Handling Device XF Brun, SN Melkote International Manufacturing Science and Engineering Conference 48524, 351-358, 2008 | 11 | 2008 |
Low temperature Direct Bonding of SiN and SiO interfaces for packaging applications XF Brun, J Burggraf, B Ruxandra-Aida, C Mühlstätter 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 182-187, 2020 | 10 | 2020 |
Modeling and experimental verification of partial slip for multiple frictional contact problems XF Brun, SN Melkote Wear 265 (1-2), 34-41, 2008 | 10 | 2008 |
Separation apparatus, separation system, and separation method O Hirakawa, M Honda, XF Brun, CW Singleton Jr US Patent 9,827,756, 2017 | 8 | 2017 |
Thermal History Index as a bulk quality indicator for Czochralski solar wafers J Veirman, B Martel, E Letty, R Peyronnet, G Raymond, M Cascant, ... Solar Energy Materials and Solar Cells 158, 55-59, 2016 | 7 | 2016 |
Microelectronic component having molded regions with through-mold vias S Ganesan, R Viswanath, XF Brun, TA Ibrahim, JM Gamba, M Dubey, ... US Patent 11,302,643, 2022 | 6 | 2022 |
Heat assisted handling of highly warped substrates post temporary bonding XF Brun, H Ma US Patent 9,437,468, 2016 | 6 | 2016 |
Separation apparatus, separation system, and separation method O Hirakawa, M Honda, A Fukutomi, T Tamura, J Harada, N Kazutaka, ... US Patent 10,071,544, 2018 | 5 | 2018 |
Peeling device, peeling system and peeling method O Hirakawa, N Yoshitaka, M Honda, XF Brun, CW Singleton Jr US Patent 9,919,509, 2018 | 5 | 2018 |
Patterned adhesive tape for backgrinding processes D Xu, XF Brun US Patent App. 13/992,511, 2013 | 5 | 2013 |
Characterization of 300 mm low temperature SiCN PVD films for hybrid bonding application XF Brun, MM Hasan, Y Yang, P Carazzetti, C Drechsel, E Strolz 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 548-555, 2023 | 4 | 2023 |
Separation method, separation apparatus, and separation system O Hirakawa, M Honda, XF Brun, CW Singleton Jr US Patent 9,956,755, 2018 | 4 | 2018 |