| Characterization of Al2O3/LaAlO3/SiO2 Gate Stack on 4H-SiC After Post-Deposition Annealing L Huang, Y Liu, C Xiao, Y Ding, X Peng, Y Onozawa, T Tsuji, N Fujishima, ... IEEE Transactions on Electron Devices 68 (4), 2133-2137, 2021 | 67 | 2021 |
| A new fan-out-package-embedded power inductor technology Y Ding, X Fang, R Wu, JKO Sin IEEE Electron Device Letters 41 (2), 268-271, 2019 | 13 | 2019 |
| A high-efficiency double-side Silicon-embedded inductor for integrated DC–DC converter applications G Lv, N Liao, Y Ding, X Fang, F Bai, JKO Sin, R Wu IEEE Transactions on Electron Devices 68 (9), 4801-4804, 2021 | 7 | 2021 |
| A suspended thick-winding inductor for integrated voltage regulator applications Y Ding, X Fang, R Wu, Q Guo, JKO Sin IEEE Electron Device Letters 41 (1), 95-98, 2019 | 7 | 2019 |
| Fan-out-package-embedded coupled inductors for integrated voltage conversion Y Ding, X Fang, R Wu, JKO Sin 2020 32nd International Symposium on Power Semiconductor Devices and ICs …, 2020 | 6 | 2020 |
| A power inductor integration technology using a silicon interposer for DC-DC converter applications Y Ding, X Fang, Y Gao, Y Cai, X Qiu, PKT Mok, SWR Lee, KM Lau, ... 2018 IEEE 30th International Symposium on Power Semiconductor Devices and …, 2018 | 6 | 2018 |
| An implantable, wireless, battery-free system for tactile pressure sensing L Du, H Hao, Y Ding, A Gabros, TCE Mier, J Van der Spiegel, TH Lucas, ... Microsystems & Nanoengineering 9 (1), 130, 2023 | 3 | 2023 |
| Frequency Tunable Magnetostatic Wave Filters With Zero Static Power Magnetic Biasing Circuitry X Du, MH Idjadi, Y Ding, T Zhang, AJ Geers, S Yao, JB Pyo, F Aflatouni, ... arXiv preprint arXiv:2308.00907, 2023 | 3 | 2023 |
| A silicon molded metal transfer process for on-chip suspended power inductors Y Ding, X Fang, R Wu, Q Guo, JKO Sin 2019 20th International Conference on Solid-State Sensors, Actuators and …, 2019 | 3 | 2019 |
| An implantable wireless tactile sensing system L Du, H Hao, Y Ding, A Gabros, TCE Mier, J Van der Spiegel, TH Lucas, ... Research Square, 2023 | 2 | 2023 |
| 17.10 A 0.4 V, 750nW, Individually Accessible Wireless Capacitive Sensor Interface IC for a Tactile Sensing Network H Hao, AG Richardson, Y Ding, L Du, MG Allen, J Van der Spiegel, ... 2024 IEEE International Solid-State Circuits Conference (ISSCC) 67, 332-334, 2024 | 1 | 2024 |
| Magnetostatic Wave Notch Filters Frequency Tuned Via a Zero DC Power Magnetic Bias Circuit X Du, S Yao, Y Ding, Z Yu, AJ Geers, F Aflatouni, MG Allen, RH Olsson 2024 IEEE International Microwave Filter Workshop (IMFW), 176-179, 2024 | | 2024 |
| A Biocompatible Glass-Encapsulated Triaxial Force Sensor For Implantable Tactile Sensing Applications Y Ding, L Du, H Hao, TCE Mier, J Van der Spiegel, TH Lucas, F Aflatouni, ... 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems …, 2024 | | 2024 |
| A PCB-Integrated Inductor with an Additively Electrodeposited Laminated NiFe Core for MHz DC-DC Power Conversion Y Ding, X Wang, MG Allen IEEE Transactions on Power Electronics, 2023 | | 2023 |
| A Novel Conformal Thick Oxide Technology for On-Chip High-Voltage Isolation G Lv, Y Ding, X Fang, L Li, F Bai, JKO Sin, R Wu IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2022 | | 2022 |
