| SAC–xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly F Che Ani, A Jalar, AA Saad, CY Khor, R Ismail, Z Bachok, MA Abas, ... Soldering & Surface Mount Technology 30 (1), 1-13, 2018 | 34 | 2018 |
| Characterization of SAC–x NiO nano-reinforced lead-free solder joint in an ultra-fine package assembly F Che Ani, A Jalar, AA Saad, CY Khor, MA Abas, Z Bachok, NK Othman Soldering & Surface Mount Technology 31 (2), 109-124, 2019 | 22 | 2019 |
| The influence of Fe2O3 nano-reinforced SAC lead-free solder in the ultra-fine electronics assembly F Che Ani, A Jalar, AA Saad, CY Khor, R Ismail, Z Bachok, MA Abas, ... The International Journal of Advanced Manufacturing Technology 96, 717-733, 2018 | 20 | 2018 |
| Structural Assessment of Lead Free Solder Joint of Miniaturized Electronics Assembly Z Bachok, AA Saad, FC Ani, A Jalar, MA Abas International Journal of Integrated Engineering 10 (5), 2018 | 6 | 2018 |
| Investigation of hygrothermally induced failures in multilayer ceramic capacitors during thermal reflow process RK Apalowo, A Abas, Z Bachok, MFM Sharif, FC Ani, MR Ramli, ... Microelectronics Reliability 146, 115028, 2023 | 4 | 2023 |
| Effect of Different Solder Volumes on the Laser Soldering Process: Numerical and Experimental Investigation Z Bachok, MA Abas, MZH Nazarudin, SA Zahiri, MF Mohd Sharif, ... Journal of Electronic Packaging 144 (4), 041018, 2022 | 4 | 2022 |
| Structural analysis and material characterization of silver conductive ink for stretchable electronics S Zulfiqar, AA Saad, Z Ahmad, F Yusof, Z Bachok International Journal of Integrated Engineering 13 (7), 128-135, 2021 | 4 | 2021 |
| Soldering & Surface Mount Technology F Che Ani, A Jalar, A Aziz Saad, C Yee Khor, R Ismail, Z Bachok, ... E 30 (1), 2018 | 4 | 2018 |
| A study on the damage evolution of P91 steel under cyclic loading at high temperature AA Saad, Z Bachok, W Sun International Journal of Automotive and Mechanical Engineering 13 (3), 3564-3573, 2016 | 3 | 2016 |
| Investigation of moisture-induced crack propagation in the soft termination multi-layer ceramic capacitor during thermal reflow process Z Bachok, A Abas, HALR Gobal, N Yusoff, MR Ramli, MFM Sharif, FC Ani, ... Soldering & Surface Mount Technology, 2023 | 2 | 2023 |
| Structural analysis on nanocomposites lead free solder using nanoindentation Z Bachok, AA Saad, MA Abas, MYT Ali, K Fakpan Journal of Advanced Manufacturing Technology (JAMT) 16 (2), 2022 | 1 | 2022 |
| Advanced Assembly of Miniaturized Surface Mount Technology Components Using Nano-reinforced Solder Paste FC Ani, AA Saad, A Jalar, CY Khor, MA Abas, Z Bachok Recent Progress in Lead-Free Solder Technology: Materials Development …, 2022 | 1 | 2022 |
| Deformation and crack growth in multilayered ceramic capacitor during thermal reflow process: numerical and experimental investigation RK Apalowo, MA Abas, Z Bachok, MFM Sharif, F Che Ani, MR Ramli, ... Microelectronics International, 2024 | | 2024 |
| Hyper-Elastic Characterization of Polydimethylsiloxane by Optimization Algorithms and Finite Element Methods S Zulfiqar, AA Saad, IA Huqqani, Z Ahmad, F Yusof, Z Bachok Arabian Journal for Science and Engineering, 1-23, 2024 | | 2024 |
| Numerical Analysis and Validation of Characterization of Polydimethylsiloxane Using Hyper-elastic Constitutive Models S Zulfiqar, AA Saad, Z Ahmad, F Yusof, Z Bachok Pertanika Journal of Science & Technology (PJST) 31 (6), 2023 | | 2023 |
| Mechanical Analysis and Constitutive Modeling of Nonlinear Behavior of Silver-based Conductive Ink S Zulfikar, AA Saad, Z Ahmad, Z Bachok International Journal of Automotive and Mechanical Engineering 20 (3), 10635 …, 2023 | | 2023 |
| Analysis of Cyclic and Dynamic Behavior of Silver-based Conductive Ink for Stretchable Electronics S Zulfiqar, AA Saad, MD Shafiq, Z Bachok Proceedings of The 7th Symposium on Damage Mechanics of Materials and …, 2023 | | 2023 |
| Structural Assessment of Silver Conductive Ink using Nanoindentation Z Bachok, AA Saad, S Zulfiqar, A Abas, MD Shafiq Proceedings of The 7th Symposium on Damage Mechanics of Materials and …, 2023 | | 2023 |
| Structural Analysis of Silver-Based Conductive Ink Under Cyclic Loading S Zulfiqar, AA Saad, Z Ahmad, F Yusof, Z Bachok Green Materials and Electronic Packaging Interconnect Technology Symposium …, 2022 | | 2022 |
| Influence Of Aluminum Particles On Thermal Interface Material Hardness And Thermal Conductivity R. Kamarudin, M. Z. Abdullah, Z. Bachok, M. S. Abdul Aziz, F. Che Ani INTERNATIONAL JOURNAL OF SCIENTIFIC & TECHNOLOGY RESEARCH 9 (12), 2020 | | 2020 |
