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Co-authors
- Vladimir OkhmatovskiUniversity of ManitobaVerified email at umanitoba.ca
- FARHAD SHEIKH HOSSEINI LORIGeneral MotorsVerified email at gm.com
- Reza GholamiSenior 3D EM solver developer, Siemens EDAVerified email at Siemens.com
- Ali YilmazPrincipal Research Scientist, Lockheed MartinVerified email at lmco.com
- Mohammad ShafieipourSafe Engineering Services (SES)Verified email at sestech.com
- Jamiu Babatunde MojolagbeUniversity of ManitobaVerified email at myumanitoba.ca
- Zhuotong ChenUniversity of California Santa BarbaraVerified email at ucsb.edu
- Yaniv BrickBen-Gurion University of the NegevVerified email at bgu.ac.il
- Henning BraunischPrincipal Engineer, Components Research, Intel CorporationVerified email at intel.com
- Kemal AygunFellow, Assembly and Test Technology Development, Intel CorporationVerified email at intel.com
- Jackson W. MasseyGraduate Research Assistant, The University of Texas at AustinVerified email at utexas.edu
- Carlos Torres-VerdinUniversity of Texas at Austin, Cockrell School of EngineeringVerified email at austin.utexas.edu
- Kai YangThe University of Texas at AustinVerified email at utexas.edu