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Kenneth E. GoodsonStanford Mechanical Engineering, Davies Provostial ProfessorVerified email at stanford.edu
H.-S. Philip WongProfessor of Electrical Engineering, Stanford UniversityVerified email at stanford.edu
Feng XiongAssociate Professor, Department of Electrical and Computer Engineering, University of PittsburghVerified email at pitt.edu
David EstradaBoise State University; Idaho National LaboratoryVerified email at boisestate.edu
Myung-Ho BaeKorea Research Institute of Standards and Science, mhbae@kriss.re.krVerified email at kriss.re.kr
Eilam YalonTechnion, Israel Institute of TechnologyVerified email at technion.ac.il
Ashkan BehnamDevice Engineer, MicronVerified email at micron.com
Connor J. McClellanStanford UniversityVerified email at stanford.edu
Joseph W. LydingProfessor of Electrical and Computer Engineering, University of IllinoisVerified email at illinois.edu
Albert LiaoEmerging Memory Engineer, MicronVerified email at micron.com
Zhun-Yong OngResearch Scientist, Institute of High Performance Computing, SingaporeVerified email at ihpc.a-star.edu.sg
Sanchit DeshmukhPhD, Stanford UniversityVerified email at alumni.stanford.edu
Hongjie DaiProfessor of chemistry, stanford universityVerified email at stanford.edu
Dr. Miguel Muñoz Rojo - ERC granteeTenured permanent researcher (CSIC) & Associate Prof. (University of Twente)Verified email at csic.es
Joshua D. WoodDirector, Solutions Engineering, DynatraceVerified email at dynatrace.com
Krishna SaraswatProfessor of Electrical Engineering, Stanford UniversityVerified email at stanford.edu
Saurabh V. SuryavanshiSynopsysVerified email at suryavanshi.me
William P. KingRalph A. Andersen Endowed Chair, Department of Mechanical Science and Engineering, University ofVerified email at illinois.edu
Feifei LianStanford UniversityVerified email at stanford.edu
Michal Jakub MleczkoDevice Engineer, IntelVerified email at stanford.edu