| Study of anisotropic etching of (1 0 0) Si with ultrasonic agitation J Chen, L Liu, Z Li, Z Tan, Q Jiang, H Fang, Y Xu, Y Liu Sensors and Actuators A: Physical 96 (2-3), 152-156, 2002 | 86 | 2002 |
| Fabricating microstructures on glass for microfluidic chips by glass molding process T Wang, J Chen, T Zhou, L Song Micromachines 9 (6), 269, 2018 | 72 | 2018 |
| Numerical modeling and experimental verification of through silicon via (TSV) filling in presence of additives Y Zhu, S Ma, X Sun, J Chen, M Miao, Y Jin Microelectronic Engineering 117, 8-12, 2014 | 46 | 2014 |
| On the single-chip condenser miniature microphone using DRIE and backside etching techniques J Chen, L Liu, Z Li, Z Tan, Y Xu, J Ma Sensors and Actuators A: Physical 103 (1-2), 42-47, 2003 | 41 | 2003 |
| Screening the optimal hierarchical micro/nano pattern design for the neck and body surface of titanium implants P Zhou, F Mao, F He, Y Han, H Li, J Chen, S Wei Colloids and Surfaces B: Biointerfaces 178, 515-524, 2019 | 34 | 2019 |
| Wafer level bulk titanium ICP etching using SU8 as an etching mask G Zhao, Q Shu, Y Tian, Y Zhang, J Chen Journal of Micromechanics and Microengineering 19 (9), 095006, 2009 | 27 | 2009 |
| Fabrication and RF property evaluation of high-resistivity Si interposer for 2.5-D/3-D heterogeneous integration of RF devices J Yan, S Ma, Y Jin, W Wang, J Chen, R Luo, H Cai, J Li, Y Xia, L Hu, S He, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 8 …, 2018 | 26 | 2018 |
| Anisotropic equivalent thermal conductivity model for efficient and accurate full-chip-scale numerical simulation of 3D stacked IC Y Pi, N Wang, J Chen, M Miao, Y Jin, W Wang International journal of heat and mass transfer 120, 361-378, 2018 | 26 | 2018 |
| Introduction to microsystem packaging technology Y Jin, Z Wang, J Chen CRC Press, 2010 | 25 | 2010 |
| Finite element analysis of microneedle insertion into skin S Chen, N Li, J Chen Micro & Nano Letters 7 (12), 1206-1209, 2012 | 23 | 2012 |
| Controlling cell viability and bacterial attachment through fabricating extracellular matrix-like micro/nanostructured surface on titanium implant P Zhou, S Long, F Mao, H Huang, H Li, F He, R Zhang, L Ren, J Chen, ... Biomedical Materials 15 (3), 035002, 2020 | 21 | 2020 |
| Measurement-based electrical characterization of through silicon vias and transmission lines for 3D integration X Sun, R Fang, Y Zhu, X Zhong, Y Bian, Y Guan, M Miao, J Chen, Y Jin Microelectronic Engineering 149, 145-152, 2016 | 20 | 2016 |
| Single-chip condenser miniature microphone with a high sensitive circular corrugated diaphragm J Chen, L Liu, Z Li, Z Tan, Y Xu, J Ma Technical Digest. MEMS 2002 IEEE International Conference. Fifteenth IEEE …, 2002 | 20 | 2002 |
| A fast and accurate temperature prediction method for microfluidic cooling with multiple distributed hotspots Y Pi, J Chen, M Miao, Y Jin, W Wang International Journal of Heat and Mass Transfer 127, 1223-1232, 2018 | 17 | 2018 |
| Thermal and electrical characterization of TSV interposer embedded with microchannel for 2.5 D integration of GaN RF devices H Cai, S Ma, W Wang, Y Jin, J Chen, J Zhang, W Xiang, L Hu, S He 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2156-2162, 2018 | 16 | 2018 |
| Fabrication and characterization of a tungsten microneedle array based on deep reactive ion etching technology S Ma, Y Xia, Y Wang, K Ren, R Luo, L Song, X Chen, J Chen, Y Jin Journal of Vacuum Science & Technology B 34 (5), 2016 | 15 | 2016 |
| A 3D micro-channel cooling system embedded in LTCC packaging substrate S Jia, M Miao, R Fang, S Guo, D Hu, Y Jin 2012 7th IEEE International Conference on Nano/Micro Engineered and …, 2012 | 15 | 2012 |
| A designable surface via the micro-molding process Z Wang, L Xu, X Wu, J Chen Microsystems & Nanoengineering 4 (1), 1-8, 2018 | 14 | 2018 |
| Design and optimization of redistribution layer (RDL) on TSV interposer for high frequency applications Q Cui, X Sun, Y Zhu, S Ma, J Chen, M Miao, Y Jin 2011 12th International Conference on Electronic Packaging Technology and …, 2011 | 14 | 2011 |
| Ultra-sensitive, highly reproducible film stress characterization using flexible suspended thin silicon plates and local curvature measurements YJ Tang, J Chen, YB Huang, SS Wang, ZH Li, WD Zhang Journal of Micromechanics and Microengineering 17 (10), 1923, 2007 | 14 | 2007 |
yong guanPeking UniversityVerified email at pku.edu.cn
