| Effect of voids on the reliability of BGA/CSP solder joints M Yunus, K Srihari, JM Pitarresi, A Primavera Microelectronics reliability 43 (12), 2077-2086, 2003 | 229 | 2003 |
| Introduction to solid mechanics IH Shames, JM Pitarresi (No Title), 1989 | 220 | 1989 |
| Comparison of modeling techniques for the vibration analysis of printed circuit cards JM Pitarresi, AA Primavera | 101 | 1992 |
| Transient dynamic simulation and full-field test validation for a slim-PCB of mobile phone under drop/impact S Park, C Shah, J Kwak, C Jang, J Pitarresi, T Park, S Jang 2007 Proceedings 57th Electronic Components and Technology Conference, 914-923, 2007 | 100 | 2007 |
| Mechanical shock testing and modeling of PC motherboards J Pitarresi, B Roggeman, S Chaparala, P Geng 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004 | 98 | 2004 |
| Computationally efficient approaches to characterize the dynamic response of microstructures under mechanical shock MI Younis, D Jordy, JM Pitarresi Journal of Microelectromechanical Systems 16 (3), 628-638, 2007 | 85 | 2007 |
| Dynamic modeling and measurement of personal computer motherboards J Pitarresi, P Geng, W Beltman, Y Ling 52nd Electronic Components and Technology Conference 2002.(Cat. No …, 2002 | 76 | 2002 |
| Random vibration response of a surface mount lead/solder joint JM Pitarresi, A Akanda Advances in electronic packaging 4 (1), 1993 | 73 | 1993 |
| Modeling of printed circuit cards subject to vibration JM Pitarresi IEEE International Symposium on Circuits and Systems, 2104-2107, 1990 | 64 | 1990 |
| The" smeared" property technique for the FE vibration analysis of printed circuit cards JM Pitarresi, DV Caletka, R Caldwell, DE Smith | 62 | 1991 |
| Assessment of PCB pad cratering resistance by joint level testing B Roggeman, P Borgesen, J Li, G Godbole, P Tumne, K Srihari, T Levo, ... 2008 58th Electronic Components and Technology Conference, 884-892, 2008 | 50 | 2008 |
| Effect of geometry and temperature cycle on the reliability of WLCSP solder joints SC Chaparala, BD Roggeman, JM Pitarresi, BG Sammakia, J Jackson, ... IEEE transactions on components and packaging technologies 28 (3), 441-448, 2005 | 41 | 2005 |
| The smeared properties approach to FE vibration modeling of printed circuit cards JM Pitarresi, D Celetka, R Coldwel, D Smith ASME Journal of Electronics Packaging 113 (3), 250-257, 1991 | 41 | 1991 |
| Accelerated vibration reliability testing of electronic assemblies using sine dwell with resonance tracking QT Su, MA Gharaibeh, AJ Stewart, JM Pitarresi, MK Anselm Journal of Electronic Packaging 140 (4), 041004, 2018 | 39 | 2018 |
| Random vibration fatigue life analysis of electronic packages by analytical solutions and Taguchi method MA Gharaibeh, JM Pitarresi Microelectronics Reliability 102, 113475, 2019 | 35 | 2019 |
| Analytical solution for electronic assemblies under vibration MA Gharaibeh, QT Su, JM Pitarresi Journal of Electronic Packaging 138 (1), 011003, 2016 | 30 | 2016 |
| Board level energy correlation and interconnect reliability modeling under drop impact A Agrawal, T Levo, J Pitarresi, B Roggeman 2009 59th Electronic Components and Technology Conference, 1694-1702, 2009 | 27 | 2009 |
| Optimal design procedures for active structures JZ Cha, JM Pitarresi, TT Soong Journal of Structural Engineering 114 (12), 2710-2723, 1988 | 24 | 1988 |
| Analytical model for the transient analysis of electronic assemblies subjected to impact loading MA Gharaibeh, QT Su, JM Pitarresi Microelectronics Reliability 91, 112-119, 2018 | 20 | 2018 |
| Solder joint reliability prediction by the integrated matrix creep method RJ Iannuzzelli, JM Pitarresi, V Prakash | 20 | 1996 |
