| ZnO sol–gel derived porous film for CO gas sensing HW Ryu, BS Park, SA Akbar, WS Lee, KJ Hong, YJ Seo, DC Shin, JS Park, ... Sensors and Actuators B: Chemical 96 (3), 717-722, 2003 | 188 | 2003 |
| Preferred orientations of NiO thin films prepared by RF magnetron sputtering HW Ryu, GP Choi, WS Lee, JS Park Journal of materials science 39 (13), 4375-4377, 2004 | 75 | 2004 |
| An optimization of tungsten plug chemical mechanical polishing (CMP) using different consumables WS Lee, SY Kim, YJ Seo, JK Lee Journal of Materials Science: Materials in Electronics 12, 63-68, 2001 | 74 | 2001 |
| Temperature effects of pad conditioning process on oxide CMP: Polishing pad, slurry characteristics, and surface reactions NH Kim, YJ Seo, WS Lee Microelectronic Engineering 83 (2), 362-370, 2006 | 59 | 2006 |
| Effects of slurry filter size on the chemical mechanical polishing (CMP) defect density YJ Seo, SY Kim, YO Choi, YT Oh, WS Lee Materials letters 58 (15), 2091-2095, 2004 | 58 | 2004 |
| Effects of NiO addition in WO3-based gas sensors prepared by thick film process W Noh, Y Shin, J Kim, W Lee, K Hong, SA Akbar, J Park Solid State Ionics 152, 827-832, 2002 | 58 | 2002 |
| Structural and surface properties of NiCr thin films prepared by DC magnetron sputtering under variation of annealing conditions Y Kwon, NH Kim, GP Choi, WS Lee, YJ Seo, J Park Microelectronic Engineering 82 (3-4), 314-320, 2005 | 49 | 2005 |
| Electrical and optical properties of sputter-deposited cadmium sulfide thin films optimized by annealing temperature NH Kim, SH Ryu, HS Noh, WS Lee Materials science in semiconductor processing 15 (2), 125-130, 2012 | 48 | 2012 |
| Influences of thickness-uniformity and surface morphology on the electrical and optical properties of sputtered CdTe thin films for large-area II–VI semiconductor … YO Choi, NH Kim, JS Park, WS Lee Materials Science and Engineering: B 171 (1-3), 73-78, 2010 | 40 | 2010 |
| Reduction of process defects using a modified set-up for chemical mechanical polishing equipment YJ Seo, SY Kim, WS Lee Microelectronic engineering 65 (4), 371-379, 2003 | 40 | 2003 |
| Effects of different oxidizers on the W-CMP performance YJ Seo, WS Lee Materials Science and Engineering: B 118 (1-3), 281-284, 2005 | 38 | 2005 |
| A study on the chemical mechanical polishing of oxide film using a zirconia (ZrO2)-mixed abrasive slurry (MAS) SW Park, YJ Seo, WS Lee Microelectronic Engineering 85 (4), 682-688, 2008 | 37 | 2008 |
| Chemical mechanical polishing and electrochemical characteristics of tungsten using mixed oxidizers with hydrogen peroxide and ferric nitrate YJ Seo, NH Kim, WS Lee Materials Letters 60 (9-10), 1192-1197, 2006 | 37 | 2006 |
| Effects of oxidant additives for exact selectivity control of W-and Ti-CMP process YJ Seo, WS Lee Microelectronic engineering 77 (2), 132-138, 2005 | 36 | 2005 |
| Chemical mechanical polishing (CMP) mechanisms of thermal SiO2 film after high-temperature pad conditioning NH Kim, PJ Ko, GW Choi, YJ Seo, WS Lee Thin Solid Films 504 (1-2), 166-169, 2006 | 34 | 2006 |
| Improvements of oxide-chemical mechanical polishing performances and aging effect of alumina and silica mixed abrasive slurries YJ Seo, WS Lee, P Yeh Microelectronic engineering 75 (4), 361-366, 2004 | 32 | 2004 |
| Photocurrent study of the valence band splitting of AgInS2 epilayers on GaAs KJ Hong, JW Jeong, TS Jeong, CJ Youn, WS Lee, JS Park, DC Shin Journal of Physics and Chemistry of Solids 64 (7), 1119-1124, 2003 | 31 | 2003 |
| Chemical mechanical polishing of Ba0. 6Sr0. 4TiO3 film prepared by sol–gel method YJ Seo, WS Lee Microelectronic Engineering 75 (2), 149-154, 2004 | 28 | 2004 |
| Advantages of point of use (POU) slurry filter and high spray method for reduction of CMP process defects YJ Seo, SY Kim, WS Lee Microelectronic engineering 70 (1), 1-6, 2003 | 28 | 2003 |
| Optimization of post-CMP cleaning process for elimination of CMP slurry-induced metallic contaminations YJ Seo, WS Lee, SY Kim, JS Park, EG Chang Journal of Materials Science: Materials in Electronics 12, 411-415, 2001 | 28 | 2001 |
