| Microcontact-enhanced thermoelectric cooling of ultrahigh heat flux hotspots M Manno, B Yang, S Khanna, P McCluskey, A Bar-Cohen IEEE Transactions on Components, Packaging and Manufacturing Technology 5 …, 2015 | 28 | 2015 |
| Thin thermally efficient ICECool defense semiconductor power amplifiers S Khanna, P McCluskey, A Bar-Cohen, B Yang, M Ohadi Journal of Microelectronics and Electronic Packaging 14 (3), 77-93, 2017 | 7 | 2017 |
| Structural reliability of novel 3-D integrated thermal packaging for power electronics S Khanna, P McCluskey, M Manno, A Bar-Cohen, B Yang, M Ohadi ASME International Mechanical Engineering Congress and Exposition 57533 …, 2015 | 4 | 2015 |
| Combinatorial Cu-Ni Alloy Thin-Film Catalysts for Layer Number Control in Chemical Vapor-Deposited Graphene SR Khanna, MG Stanford, IV Vlassiouk, PD Rack Nanomaterials 12 (9), 1553, 2022 | 3 | 2022 |
| Reliable integration of microchannel coolers for power electronics D Squiller, S Khanna, S Dessiatoun, R Mandel, M Ohadi, P McCluskey International Electronic Packaging Technical Conference and Exhibition 56901 …, 2015 | 3 | 2015 |
| The effect of thermally induced piezoelectricity on GaN HEMT device characteristics J Sengupta, P McCluskey, S Khanna ECS Transactions 66 (7), 71, 2015 | 1 | 2015 |
| Combinatorial CuNi alloy thin film catalysts for layer number regulation in CVD grown graphene S Khanna | | 2022 |
| Finite Element Based Stress Analysis and Optimization of Crankshaft S Khanna, S Singh, K Jadhav, BJ Chauhan | | |
| REVISED DRAFT-IMECE2015-53749 S Khanna, P McCluskey, M Manno, A Bar-Cohen, B Yang, M Ohadi | | |
