| Resistivity scaling due to electron surface scattering in thin metal layers T Zhou, D Gall Physical Review B 97 (16), 165406, 2018 | 71 | 2018 |
| Electron channeling in TiO2 coated Cu layers P Zheng, T Zhou, D Gall Semiconductor Science and Technology 31 (5), 055005, 2016 | 52 | 2016 |
| The electrical resistivity of rough thin films: A model based on electron reflection at discrete step edges T Zhou, P Zheng, SC Pandey, R Sundararaman, D Gall Journal of Applied Physics 123 (15), 155107, 2018 | 51 | 2018 |
| Surface roughness dependence of the electrical resistivity of W (001) layers PY Zheng, T Zhou, BJ Engler, JS Chawla, R Hull, D Gall Journal of Applied Physics 122 (9), 095304, 2017 | 41 | 2017 |
| Resistivity Size Effect in Epitaxial Rh (001) and Rh (111) Layers A Jog, T Zhou, D Gall IEEE Transactions on Electron Devices 68 (1), 257-263, 2020 | 29 | 2020 |
| A first-principles analysis of ballistic conductance, grain boundary scattering and vertical resistance in aluminum interconnects T Zhou, NA Lanzillo, P Bhosale, D Gall, R Quon AIP Advances 8 (5), 055127, 2018 | 18 | 2018 |
| Narrow interconnects: The most conductive metals D Gall, A Jog, T Zhou 2020 IEEE International Electron Devices Meeting (IEDM), 32.3. 1-32.3. 4, 2020 | 11 | 2020 |
| Nonlinear Landau-Zener tunneling in Majorana’s stellar representation Q Guo, H Liu, T Zhou, XZ Chen, B Wu The European Physical Journal D 70 (6), 1-5, 2016 | 6 | 2016 |
| Planar resistive random-access memory (RRAM) device with a shared top electrode Ashim Dutta, Saumya Sharma, Tianji ZHOU, Chih-Chao Yang US Patent US11227997B1, 2022 | | 2022 |
| Planar resistive random-access memory (rram) device with a shared top electrode Ashim Dutta, Saumya Sharma, Tianji ZHOU, Chih-Chao Yang US Patent US20220013723A1, 2022 | | 2022 |
| E-Fuse with Dielectric Zipping Tianji ZHOU, Saumya Sharma, Ashim Dutta, Chih-Chao Yang US Patent US20210391256A1, 2021 | | 2021 |
| Embedding mram device in advanced interconnects Ashim Dutta, Saumya Sharma, Tianji ZHOU, Chih-Chao Yang US Patent US20210375986A1, 2021 | | 2021 |
| Forming decoupled interconnects Ashim Dutta, Saumya Sharma, Tianji ZHOU, Chih-Chao Yang US Patent US20210358801A1, 2021 | | 2021 |
| Embedded small via anti-fuse device SS Chih-Chao Yang, Baozhen Li, Tianji ZHOU, Ashim Dutta US Patent US11177213B2, 2021 | | 2021 |
| Interconnect structures with selective capping layer Tianji ZHOU, Saumya Sharma, Ashim Dutta, Chih-Chao Yang US Patent US20210328137A1, 2021 | | 2021 |
| Metal surface preparation for increased alignment contrast Tianji ZHOU, Saumya Sharma, Dominik Metzler, Chih-Chao Yang, Theodorus E ... US Patent US20210210434A1, 2021 | | 2021 |
