| Nontoxic bio-plasticizers for PVC as replacements for conventional toxic plasticizers W Brostow, X Lu, AT Osmanson Polymer Testing 69, 63-70, 2018 | 71 | 2018 |
| Smartphone optosensing platform using a DVD grating to detect neurotoxins LJ Wang, YC Chang, X Ge, AT Osmanson, D Du, Y Lin, L Li ACS Sensors 1 (4), 366-373, 2016 | 63 | 2016 |
| Effects of UV stabilizers on polypropylene outdoors W Brostow, X Lu, O Gencel, AT Osmanson Materials 13 (7), 1626, 2020 | 20 | 2020 |
| Flexibility of polymers defined and related to dynamic friction W Brostow, HE Hagg Lobland, HJ Hong, S Lohse, AT Osmanson J. Mater. Sci. Res 8 (3), 31-35, 2019 | 20 | 2019 |
| Separation of metal and plastic wastes from wire and cable manufacturing for effective recycling K Barbakadze, W Brostow, G Granowski, N Hnatchuk, S Lohse, ... Resources, Conservation and Recycling 139, 251-258, 2018 | 19 | 2018 |
| Nano-Al (OH)3 and Mg (OH)2 as flame retardants for polypropylene used on wires and cables W Brostow, S Lohse, X Lu, AT Osmanson Emergent Materials 2, 23-34, 2019 | 18 | 2019 |
| Facile continuous production of soy peptide nanogels via nanoscale flash desolvation for drug entrapment LJ Wang, YC Chang, AT Osmanson, J Zhang, L Li International journal of pharmaceutics 549 (1-2), 13-20, 2018 | 16 | 2018 |
| From mechanics to thermodynamics: A relation between the brittleness and the thermal expansivity for polymers W Brostow, AT Osmanson Materials Letters: X 1, 100005, 2019 | 9 | 2019 |
| Electromigration effect on the Pd coated Cu wirebond M Tajedini, AT Osmanson, YR Kim, H Madanipour, CU Kim, B Glasscock, ... 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 661-666, 2021 | 7 | 2021 |
| Properties of lightweight concrete blocks with waste zeolitic tuff I Tekin, T Kotan, AT Osmanson, W Brostow, O Gencel, G Martinez-Barrera | 7 | 2020 |
| Study of Electromigration Failure in Solder Interconnects under Low Frequency Pulsed Direct Current Condition YR Kim, AT Osmanson, H Madanipou, CU Kim, PF Thompson, Q Chen 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 723-728, 2020 | 5 | 2020 |
| Mechanical finishing and ion beams application to cold working tool steels: consequences for scratch resistance W Brostow, S Lohse, AT Osmanson, D Tobola, DL Weathers MRS Communications 8 (1), 178-182, 2018 | 5 | 2018 |
| Relationship Between the Grain Orientation and the Electromigration Reliability of Electronic Packaging Interconnects YR Kim, H Madanipour, AT Osmanson, M Tajedini, CU Kim, ... 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2334-2339, 2021 | 4 | 2021 |
| Current crowding and stress effects in wcsp solder interconnects: A simulative and practical study about the effects of major electromigration failure mechanisms in dc and … AT Osmanson, YR Kim, H Madanipour, M Tajedini, CU Kim, P Thompson, ... 2020 International Wafer Level Packaging Conference (IWLPC), 1-8, 2020 | 4 | 2020 |
| Effects of UBM Thickness and Current Flow Configuration on Electromigration Failure Mechanisms in Solder Interconnects YR Kim, AT Osmanson, H Madanipour, CU Kim, PF Thompson, Q Chen 2020 IEEE International Reliability Physics Symposium (IRPS), 1-5, 2020 | 4 | 2020 |
| Mechanisms of Contact Formation and Electromigration Reliability in Wirebond Packages AT Osmanson, M Tajedini, YR Kim, H Madanipour, C Kim, B Glasscock, ... 2021 IEEE International Reliability Physics Symposium (IRPS), 1-6, 2021 | 2 | 2021 |
| Observation of Fatigue and Creep Ratcheting Failure in Solder Joints under Pulsed Direct Current Electromigration Testing AT Osmanson, YR Kim, CU Kim, PF Thompson, Q Chen, S Ankamah-Kusi 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1465-1471, 2022 | 1 | 2022 |
| Study of Metallurgical Reaction and Electromigration Mechanism in Microbump with Embedded Cu Ball H Madanipour, Y Kim, AT Osmanson, M Tajedini, C Kim, D Mishra, ... 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 931-936, 2021 | 1 | 2021 |
| Study of Failure and Microstructural Evolution in SAC Solder Interconnects Induced by AC Electromigration Condition YR Kim, AT Osmanson, CU Kim, PF Thompson, Q Chen 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1153-1157, 2022 | | 2022 |
| Study of Sac Solder Interconnect Parameters in Microelectronic Packaging and Their Effects on Electromigration Failure Mechanisms AT Osmanson University of Texas at Arlington, 2022 | | 2022 |
