| Improved adhesion of polyurethane-based nanocomposite coatings to tin surface through silane coupling agents P Sivakumar, SM Du, M Selter, J Daye, J Cho International Journal of Adhesion and Adhesives 110, 102948, 2021 | 20 | 2021 |
| Regulation of the deposition morphology of inkjet-printed crystalline materials via polydopamine functional coatings for highly uniform and electrically conductive patterns L Liu, S Ma, Y Pei, X Xiong, P Sivakumar, TJ Singler ACS Applied Materials & Interfaces 8 (33), 21750-21761, 2016 | 16 | 2016 |
| Effects of bismuth and nickel on the microstructure evolution of Sn-Ag-Cu (SAC)-based solders P Sivakumar, K O’Donnell, J Cho Materials Today Communications 26, 101787, 2021 | 14 | 2021 |
| Long-term thermal aging of parylene conformal coating under high humidity and its effects on tin whisker mitigation P Sivakumar, SM Du, M Selter, I Ballard, J Daye, J Cho Polymer Degradation and Stability 191, 109667, 2021 | 4 | 2021 |
| Supplementary Laboratory Investigations of Modern Plastic-Polymer Fishplates for Rail Joints A Németh, I Fekete, S Szalai, S Fischer Nauka ta Progres Transportu 84 (6), 86-102, 2019 | 1 | 2019 |
| Polyurethane-Based Nanocomposite Coatings for Mitigation the Growth of Tin Whiskers P Sivakumar State University of New York at Binghamton, 2021 | | 2021 |
| Fire Damage and Repair Techniques for Flash Memory Modules: Implication for Post-Crash Investigations P Sivakumar, JP Lombardi, SR Cain, M Poliks, J Cash, J Gregor, ... International Symposium on Microelectronics 2016 (1), 000648-000652, 2016 | | 2016 |
| Effects of x-ray exposure on NOR and NAND flash memories during high-resolution 2D and 3D x-ray inspection A Sharma, P Sivakumar, A Feigel, IT Bae, LP Lehman, J Gregor, J Cash, ... International Symposium on Microelectronics 2016 (1), 000660-000665, 2016 | | 2016 |
| Effect of a barrier layer on the liquid state duration of Gold-Tin solder P Sivakumar State University of New York at Binghamton, 2016 | | 2016 |
| Transient liquid phase bonding technology of Bi-Ni system for high-temperature packaging applications H Fallahdoost, P Sivakumar, J Cho | | |
