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Co-authors
Liwei LinProfessor of Mechanical Engineering, University of California at BerkeleyVerified email at me.berkeley.edu- Renxiao XuUniversity of California Berkeley, Northwestern UniversityVerified email at u.northwestern.edu
- Zekai WangWuhan UniversityVerified email at whu.edu.cn
- Grace X. GuAssistant Professor, Mechanical Engineering, UC BerkeleyVerified email at berkeley.edu
- Zhizhou ZhangUniversity of California, BerkeleyVerified email at berkeley.edu
- Yingmeng XiangPhD, Electrical EngineeringVerified email at uwm.edu
- Zeyu MaoTexas A&M UniversityVerified email at tamu.edu
- Zhehan Yi, Ph.D.Chint Power Systems AmericaVerified email at gwu.edu
- Yande PengUniversity of California at BerkeleyVerified email at berkeley.edu
- Takao SomeyaProfessor, Department of Electric and Electronic Engineering, The University of TokyoVerified email at ee.t.u-tokyo.ac.jp
- Kenjiro FukudaThin-Film Device Laboratory, RIKENVerified email at riken.go.jp
- Masahito TakakuwaThe University of TokyoVerified email at ntech.t.u-tokyo.ac.jp
- Wenqing WangUniversity of TokyoVerified email at ntech.t.u-tokyo.ac.jp
- Wei YueUniversity of California, BerkeleyVerified email at berkeley.edu
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Ruiqi Guo
Postdoc at RIKEN, Guest Researcher at University of Tokyo
Verified email at berkeley.edu