| Design, modeling and simulation of MEMS devices on Si, SiC, and diamond for harsh environment applications A Kociubiński, T Bieniek, G Janczyk Acta Physica Polonica A 125 (6), 1374-1376, 2014 | 17 | 2014 |
| MEMS Product Engineering: Handling the Diversity of an Emerging Technology. Best Practices for Cooperative Development D Ortloff, T Schmidt, K Hahn, T Bieniek, G Janczyk, R Brück Springer Science & Business Media, 2013 | 15 | 2013 |
| The first and european sic eigth inches pilot line reaction project as a driver for key european sic technologies focused on power electronics development T Bieniek, G Janczyk, A Sitnik, AA Messina TechConnect Briefs, 256-259, 2019 | 11 | 2019 |
| Customer-oriented product engineering of micro and nano devices T Bieniek, G Janczyk, P Grabiec, J Szynka, S Kaliciński, P Janus, ... Proceedings of the 17th International Conference Mixed Design of Integrated …, 2010 | 11 | 2010 |
| Multi-Domain Modeling and Simulations of the Heterogeneous Systems T Pieniek, G Janczyk, P Janusz, J Szynka, P Grabiec, A Kociubiński, ... Journal of Telecommunications and Information Technology, 34-39, 2010 | 10 | 2010 |
| Investigation on reliability of interconnects in 3D heterogeneous systems by ageing beam resonance method G Janczyk, T Bieniek, J Wasowski, P Grabiec Microelectronics Journal 45 (7), 981-987, 2014 | 8 | 2014 |
| MEMS product engineering D Ortloff, T Schmidt, K Hahn, T Bieniek, G Janczyk, R Brück, D Ortloff, ... MEMS Product Engineering: Handling the Diversity of an Emerging Technology …, 2014 | 8 | 2014 |
| Dedicated MEMS-based test structure for 3D SiP interconnects reliability investigation T Bieniek, G Janczyk, R Dobrowolski, D Szmigiel, M Ekwińska, P Grabiec, ... 2013 IEEE International 3D Systems Integration Conference (3DIC), 1-6, 2013 | 8 | 2013 |
| Efficient scenarios, methodology and tools for MEMS/NEMS product development T Bieniek, G Janczyk, P Janus, M Ekwińska, D Szmigiel, K Domański, ... Proceedings of the 10th international conference on multi-material micro …, 2013 | 7 | 2013 |
| Integrated multi-domain modeling and simulation of complex 3D micro-and nanostructures T Bieniek, G Janczyk, P Janus, A Kociubinski, P Grabiec, J Szynka 2nd European Conference & Exhibition on Integration Issues of Miniaturized …, 2008 | 7 | 2008 |
| Silicon nanowires reliability and robustness investigation using AFM-based techniques T Bieniek, G Janczyk, P Janus, P Grabiec, M Nieprzecki, G Wielgoszewski, ... Electron Technology Conference 2013 8902, 654-659, 2013 | 6 | 2013 |
| Optimization on MEMS-IC SiP development reliable design methods G Janczyk, T Bieniek, P Grabiec, A Wymysłowski, R Swierczyński Third IEEE International Workshop on Testing Three-Dimensional Stacked …, 2012 | 6 | 2012 |
| Reliability aspects of 3D-oriented heterogeneous device design related to stress sensitivity of MOS transistors G Janczyk, T Bieniek, J Szynka, P Grabiec 2009 IEEE International Conference on 3D System Integration, 1-6, 2009 | 6 | 2009 |
| Specialized MEMS microphone for industrial application MA Ekwińska, T Bieniek, G Janczyk, J Wąsowski, P Janus, P Grabiec, ... Advanced Mechatronics Solutions, 453-460, 2015 | 5 | 2015 |
| Crosstalk phenomena analysis using electromagnetic wave propagation by experimental an numerical simulation methods A Palczyńska, A Wymysłowski, T Bieniek, G Janczyk, D Pasquet, TV Dinh 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics …, 2014 | 5 | 2014 |
| Methodology of MEMS-based Smart Systems Design, Modeling and Simulation-Development Practice M Ekwinska, G Janczyk, T Bieniek, P Grabiec Proceedings of Smart System Integration 2014, 2014 | 5 | 2014 |
| Novel Methodology of MEMS-IC Co-Simulation in Smart Systems Development Process T Bieniek, G Janczyk, M Marchewka, M Ekwinska, J Wasowski, P Grabiec Proceedings of Smart System Integration 2014, 2014 | 5 | 2014 |
| Micro and nano device reliability control by MOS transistors mechanical stress sensitivity estimation and flexible, customer oriented product engineering flow G Janczyk, T Bieniek, J Szynka, P Grabiec, P Janus, S Kalicinski IEEE International Reliability Workshop (IIRW10), South Lake Tahoe, 17-21, 2010 | 5 | 2010 |
| Integrated thermal modeling of heterogeneous eCubes stacked devices G Janczyk, T Bieniek, P Grabiec, J Szynka 2008 14th International Workshop on Thermal Inveatigation of ICs and Systems …, 2008 | 5 | 2008 |
| Reliability issues of e-Cubes heterogeneous system integration G Janczyk, T Bieniek, J Szynka, P Grabiec Microelectronics Reliability 48 (8-9), 1133-1138, 2008 | 5 | 2008 |
Tomasz BieniekInstytut Technologii ElektronowejVerified email at ite.waw.pl
