| A review of the performance and characterization of conventional and promising thermal interface materials for electronic package applications MCK Swamy, Satyanarayan Journal of Electronic Materials 48 (12), 7623-7634, 2019 | 70 | 2019 |
| Study on thermal contact resistance of low melting alloy used as thermal interface material MCK Swamy, R Pinto Materials Today: Proceedings 66, 2508-2512, 2022 | 3 | 2022 |
| Study on thermal resistance of brass with and without coating of metallic surface K Swamy Materials Today: Proceedings 35, 335-339, 2021 | 3 | 2021 |
| The Effect of Thermal Ageing on Solder/Substrate Interfacial Microstructures During Reflow of Sn–37Pb and Sn–3Ag–0.5 Cu Satyanarayan, MC Kumarswamy, KN Prabhu Transactions of the Indian Institute of Metals 72, 1545-1549, 2019 | 2 | 2019 |
| Characterization and investigation of performance of Sn–Bi alloy used as a thermal interface material MCK Swamy, Satyanarayan, R Pinto Journal of Materials Science: Materials in Electronics 34 (13), 1077, 2023 | | 2023 |
| Study of Thermal Contact Resistance on Interface Materials SG Shetty, G Shanbhag, S Shetty, A Shetty, KS MC | | 2018 |
Dr. SatyanarayanProfessor and Head, Dept. of Mechanical Engineering, AIETVerified email at mech.kumamoto-u.ac.jp
