| Bouc–Wen hysteresis model identification using modified firefly algorithm MA Zaman, U Sikder Journal of Magnetism and Magnetic Materials 395, 229-233, 2015 | 59 | 2015 |
| Optimization of multilayer antireflection coating for photovoltaic applications U Sikder, MA Zaman Optics & Laser Technology 79, 88-94, 2016 | 47 | 2016 |
| Bangla license plate reader for metropolitan cities of Bangladesh using template matching RA Baten, Z Omair, U Sikder 8th International Conference on Electrical and Computer Engineering, 776-779, 2014 | 29 | 2014 |
| Back-end-of-line nano-electro-mechanical switches for reconfigurable interconnects U Sikder, G Usai, TT Yen, K Horace-Herron, L Hutin, TJK Liu IEEE Electron Device Letters 41 (4), 625-628, 2020 | 22 | 2020 |
| Demonstration of 50-mV digital integrated circuits with microelectromechanical relays ZA Ye, S Almeida, M Rusch, A Perlas, W Zhang, U Sikder, J Jeon, ... 2018 IEEE International Electron Devices Meeting (IEDM), 4.1. 1-4.1. 4, 2018 | 17 | 2018 |
| There's plenty of room at the top TJK Liu, U Sikder, K Kato, V Stojanovic 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems …, 2017 | 16 | 2017 |
| Toward monolithically integrated hybrid CMOS-NEM circuits U Sikder, K Horace-Herron, TT Yen, G Usai, L Hutin, V Stojanović, TJK Liu IEEE Transactions on Electron Devices 68 (12), 6430-6436, 2021 | 10 | 2021 |
| Vertical NV-NEM switches in CMOS back-end-of-line: First experimental demonstration and array programming scheme U Sikder, LP Tatum, TT Yen, TJK Liu 2020 IEEE International Electron Devices Meeting (IEDM), 21.2. 1-21.2. 4, 2020 | 10 | 2020 |
| Optimization of idealized quantum dot intermediate band solar cells considering spatial variation of generation rates U Sikder, A Haque IEEE Access 1, 363-370, 2013 | 9 | 2013 |
| Design optimization for NEM relays implemented in BEOL layers U Sikder, TJK Liu 2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference …, 2017 | 8 | 2017 |
| Study of MEM relay contact design and body-bias effects on on-state resistance stability B Osoba, SF Almeida, U Sikder, ZA Ye, X Hu, TK Esatu, TJK Liu Journal of Microelectromechanical Systems 29 (6), 1531-1536, 2020 | 7 | 2020 |
| Design technology co-optimization for back-end-of-line nonvolatile NEM switch arrays LP Tatum, U Sikder, TJK Liu IEEE Transactions on Electron Devices 68 (4), 1471-1477, 2021 | 5 | 2021 |
| Design optimization study of reconfigurable interconnects U Sikder, G Usai, L Hutin, TJK Liu 2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM …, 2018 | 5 | 2018 |
| Non-Volatile Nano-Electro-Mechanical Switches and Hybrid Circuits in a 16 nm CMOS Back-End-of-Line Process U Sikder, R Naous, V Stojanović, TJK Liu IEEE Electron Device Letters 44 (1), 136-139, 2022 | 4 | 2022 |
| Demonstration of Low EOT Gate Stack and Record Transconductance on nm nFETs Using 1.8 nm Ferroic HfO2-ZrO2 Superlattice W Li, LC Wang, SS Cheema, N Shanker, JH Park, YH Liao, SL Hsu, ... 2021 IEEE International Electron Devices Meeting (IEDM), 13.6. 1-13.6. 4, 2021 | 4 | 2021 |
| Balancing pull-in and adhesion stability margins in non-volatile NEM switches G Usai, L Hutin, U Sikder, JL Muñoz-Gamarra, T Ernst, TJK Liu, M Vinet 2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference …, 2017 | 4 | 2017 |
| Effects of doping of intermediate band region on intermediate band solar cell characteristics U Sikder, RU Ferdous, A Haque 2012 7th International Conference on Electrical and Computer Engineering …, 2012 | 4 | 2012 |
| Characterization of interface trap density of In-rich InGaAs nMOSFETs with ALD Al2O3 as gate dielectric S Sharmin, U Sikder, QDM Khosru 2010 IEEE Nanotechnology Materials and Devices Conference, 352-355, 2010 | 4 | 2010 |
| 3D integrated CMOS-NEM systems: Enabling next-generation computing technology U Sikder, TJK Liu 2021 IEEE International Meeting for Future Electron Devices, Kansai (IMFEDK …, 2021 | 3 | 2021 |
| Body-biased multiple-gate micro-electro-mechanical relays AY Zhixin, SF Almeida, U Sikder, X Hu, TK Esatu, K Le, J Jeon, TJK Liu IEEE Electron Device Letters 42 (3), 402-405, 2021 | 2 | 2021 |
