| Thermo-mechanical characterization of metal/polymer composite filaments and printing parameter study for fused deposition modeling in the 3D printing process S Hwang, EI Reyes, K Moon, RC Rumpf, NS Kim Journal of Electronic Materials 44, 771-777, 2015 | 482 | 2015 |
| Effect of annealing temperature on optical band-gap of amorphous indium zinc oxide film JW Jeon, DW Jeon, T Sahoo, M Kim, JH Baek, JL Hoffman, NS Kim, ... Journal of Alloys and Compounds 509 (41), 10062-10065, 2011 | 93 | 2011 |
| Future direction of direct writing NS Kim, KN Han Journal of Applied Physics 108 (10), 2010 | 91 | 2010 |
| Fabrication of 3D printed metal structures by use of high-viscosity cu paste and a screw extruder S Hong, C Sanchez, H Du, N Kim Journal of electronic materials 44, 836-841, 2015 | 88 | 2015 |
| Reliability and failure analyses of thermally cycled ball grid array assemblies R Ghaffarian, NP Kim IEEE Transactions on components and packaging technologies 23 (3), 528-534, 2000 | 48 | 2000 |
| 3D printed electromagnetic transmission and electronic structures fabricated on a single platform using advanced process integration techniques PI Deffenbaugh The University of Texas at El Paso, 2014 | 46 | 2014 |
| Optimization of 3D printing parameters of Screw Type Extrusion (STE) for ceramics using the Taguchi method NP Kim, D Cho, M Zielewski Ceramics International 45 (2), 2351-2360, 2019 | 43 | 2019 |
| Recovery of platinum group metals KN Han, N Kim US Patent 7,067,090, 2006 | 40 | 2006 |
| Optimization of piston type extrusion (PTE) techniques for 3D printed food NP Kim, JS Eo, D Cho Journal of food engineering 235, 41-49, 2018 | 39 | 2018 |
| Challenges and opportunities in direct write technology using nano-metal particles KN Han, NS Kim KONA powder and Particle Journal 27, 73-83, 2009 | 38 | 2009 |
| Evaluation and characterization of reliable non-hermetic conformal coatings for microelectromechanical system (MEMS) device encapsulation J Wu, RT Pike, CP Wong, NP Kim, MH Tanielian IEEE Transactions on advanced packaging 23 (4), 721-728, 2000 | 36 | 2000 |
| Optimization of AZ91D Process and Corrosion Resistance Using Wire Arc Additive Manufacturing S Han, M Zielewski, D Holguin, M Michel, NP Kim Applied sciences 8 (8), 1306, 2018 | 35 | 2018 |
| The standardization of printable materials and direct writing systems J Hoffman, S Hwang, A Ortega, NS Kim, K Moon Journal of Electronic Packaging 135 (1), 011006, 2013 | 35 | 2013 |
| Research on NaCaHSiO4 decomposition in sodium hydroxide solution R Zhang, S Ma, Q Yang, S Zheng, Y Zhang, N Kim, S Hong Hydrometallurgy 108 (3-4), 205-213, 2011 | 33 | 2011 |
| Effect of substrate temperature on residual stress of ZnO thin films prepared by ion beam deposition JW Jeon, M Kim, LW Jang, JL Hoffman, NS Kim, IH Lee Electronic Materials Letters 8, 27-32, 2012 | 30 | 2012 |
| A simulation and experimental study on packing of nanoinks to attain better conductivity AK Amert, DH Oh, NS Kim Journal of Applied Physics 108 (10), 2010 | 30 | 2010 |
| 3D-printed conductive carbon-infused thermoplastic polyurethane NP Kim Polymers 12 (6), 1224, 2020 | 29 | 2020 |
| 3D Printed PLA/PCL/TiO 2 Composite for Bone Replacement and Grafting SE Nájera, M Michel, NS Kim MRS Advances 3 (40), 2373-2378, 2018 | 27 | 2018 |
| Kinetics of collagen microneedle drug delivery system A Aditya, B Kim, RD Koyani, B Oropeza, M Furth, J Kim, NP Kim Journal of Drug Delivery Science and Technology 52, 618-623, 2019 | 26 | 2019 |
| Single-chain atomic crystals as extracellular matrix-mimicking material with exceptional biocompatibility and bioactivity JW Lee, S Chae, S Oh, SH Kim, KH Choi, M Meeseepong, J Chang, ... Nano Letters 18 (12), 7619-7627, 2018 | 26 | 2018 |
