| Electric current effects upon the Sn/Cu and Sn/Ni interfacial reactions SW Chen, CM Chen, WC Liu Journal of electronic materials 27, 1193-1199, 1998 | 246 | 1998 |
| Phase equilibria and solidification properties of Sn-Cu-Ni alloys CH Lin, SW Chen, CH Wang Journal of Electronic Materials 31, 907-915, 2002 | 187 | 2002 |
| Solubility design leading to high figure of merit in low-cost Ce-CoSb3 skutterudites Y Tang, R Hanus, S Chen, GJ Snyder Nature communications 6 (1), 7584, 2015 | 178 | 2015 |
| Phase equilibria of the Sn–Zn–Cu ternary system C Chou, S Chen Acta Materialia 54 (9), 2393-2400, 2006 | 160 | 2006 |
| Electromigration effect upon the Sn/Ag and Sn/Ni interfacial reactions at various temperatures CM Chen, SW Chen Acta materialia 50 (9), 2461-2469, 2002 | 157 | 2002 |
| Sn–0.7 wt.% Cu/Ni interfacial reactions at 250 C C Wang, S Chen Acta Materialia 54 (1), 247-253, 2006 | 147 | 2006 |
| Phase diagrams of Pb-free solders and their related materials systems KN Subramanian, SW Chen, CH Wang, SK Lin, CN Chiu Lead-Free Electronic Solders: A Special Issue of the Journal of Materials …, 2007 | 145 | 2007 |
| Electric current effects on Sn/Ag interfacial reactions CM Chen, SW Chen Journal of electronic materials 28, 902-906, 1999 | 145 | 1999 |
| Phase diagram of In–Co–Sb system and thermoelectric properties of In-containing skutterudites Y Tang, Y Qiu, L Xi, X Shi, W Zhang, L Chen, SM Tseng, S Chen, ... Energy & Environmental Science 7 (2), 812-819, 2014 | 141 | 2014 |
| Charge‐compensated compound defects in Ga‐containing thermoelectric skutterudites Y Qiu, L Xi, X Shi, P Qiu, W Zhang, L Chen, JR Salvador, JY Cho, J Yang, ... Advanced Functional Materials 23 (25), 3194-3203, 2013 | 133 | 2013 |
| Interfacial reactions in the Sn-(Cu)/Ni, Sn-(Ni)/Cu, and Sn/(Cu, Ni) systems SW Chen, SH Wu, SW Lee Journal of electronic materials 32, 1188-1194, 2003 | 133 | 2003 |
| Temperature dependent solubility of Yb in Yb–CoSb3 skutterudite and its effect on preparation, optimization and lifetime of thermoelectrics Y Tang, S Chen, GJ Snyder Journal of Materiomics 1 (1), 75-84, 2015 | 126 | 2015 |
| Phase equilibria of the Sn-Sb binary system SW Chen, CC Chen, W Gierlotka, AR Zi, PY Chen, HJ Wu Journal of Electronic Materials 37, 992-1002, 2008 | 121 | 2008 |
| Interfacial reactions in Ag-Sn/Cu couples SW Chen, YW Yen Journal of electronic Materials 28, 1203-1208, 1999 | 116 | 1999 |
| Electromigration effect upon the Sn–0.7 wt% Cu/Ni and Sn–3.5 wt% Ag/Ni interfacial reactions C Chen, S Chen Journal of Applied Physics 90 (3), 1208-1214, 2001 | 109 | 2001 |
| Determination of the melting and solidification characteristics of solders using differential scanning calorimetry SW Chen, CC Lin, C Chen Metallurgical and Materials Transactions A 29, 1965-1972, 1998 | 96 | 1998 |
| Materials, processing and reliability of low temperature bonding in 3D chip stacking L Zhang, Z Liu, SW Chen, Y Wang, WM Long, Y Guo, S Wang, G Ye, ... Journal of Alloys and Compounds 750, 980-995, 2018 | 84 | 2018 |
| Phase equilibria of the Cu-In system I: Experimental investigation A Bolcavage, SW Chen}, CR Kao, YA Chang, AD Romig Journal of phase equilibria 14, 14-21, 1993 | 80 | 1993 |
| Solidification curves of AlCu, AlMg and AlCuMg alloys SW Chen, CC Huang Acta materialia 44 (5), 1955-1965, 1996 | 79 | 1996 |
| Quantities of grains of aluminum and those of TiB2 and Al3Ti particles added in the grain-refining processes CT Lee, SW Chen Materials Science and Engineering: A 325 (1-2), 242-248, 2002 | 72 | 2002 |
