| Transformer network-based reinforcement learning method for power distribution network (PDN) optimization of high bandwidth memory (HBM) H Park, M Kim, S Kim, K Kim, H Kim, T Shin, K Son, B Sim, S Kim, S Jeong, ... IEEE Transactions on Microwave Theory and Techniques 70 (11), 4772-4786, 2022 | 19 | 2022 |
| Reinforcement-learning-based signal integrity optimization and analysis of a scalable 3-d x-point array structure K Son, M Kim, H Park, D Lho, K Son, K Kim, S Lee, S Jeong, S Park, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2021 | 9 | 2021 |
| Policy gradient reinforcement learning-based optimal decoupling capacitor design method for 2.5-d/3-d ics using transformer network H Park, M Kim, S Kim, S Jeong, S Kim, H Kang, K Kim, K Son, G Park, ... 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2020 | 9 | 2020 |
| Reinforcement learning-based auto-router considering signal integrity M Kim, H Park, S Kim, K Son, S Kim, K Son, S Choi, G Park, J Kim 2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging …, 2020 | 9 | 2020 |
| Modeling and analysis of system-level power supply noise induced jitter (PSIJ) for 4 Gbps high bandwidth memory (HBM) I/O interface T Shin, H Park, K Kim, S Kim, K Son, K Son, G Park, J Park, S Choi, J Kim 2021 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2021 | 7 | 2021 |
| Design and analysis of thermal transmission line based embedded cooling structures for high bandwidth memory module and 2.5 D/3D ICs K Son, S Kim, S Park, H Park, K Kim, T Shin, M Kim, K Son, G Park, ... 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2020 | 7 | 2020 |
| Deep reinforcement learning-based through silicon via (TSV) array design optimization method considering crosstalk K Kim, H Park, D Lho, M Kim, K Son, K Son, S Kim, T Shin, S Choi, J Kim 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2020 | 7 | 2020 |
| Thermal and Signal Integrity Co-Design and Verification of Embedded Cooling Structure with Thermal Transmission Line (ECS-TTL) for High Bandwidth Memory Module K Son, S Kim, H Park, T Shin, K Kim, M Kim, B Sim, S Kim, G Park, S Park, ... IEEE Transactions on Components, Packaging and Manufacturing Technology, 2022 | 6 | 2022 |
| Sequential policy network-based optimal passive equalizer design for an arbitrary channel of high bandwidth memory using advantage actor critic S Choi, M Kim, H Park, K Son, S Kim, J Kim, J Park, H Kim, T Shin, K Kim, ... 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging …, 2021 | 6 | 2021 |
| Deep reinforcement learning-based pin assignment optimization of BGA packages considering signal integrity with graph representation J Park, M Kim, S Kim, K Son, T Shin, H Park, J Kim, S Choi, H Kim, K Kim, ... 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging …, 2021 | 5 | 2021 |
| A novel through mold plate (TMP) for signal and thermal integrity improvement of high bandwidth memory (HBM) K Son, S Kim, H Park, S Kim, K Kim, S Park, B Sim, S Jeong, G Park, J Kim 2020 IEEE MTT-S International Conference on Numerical Electromagnetic and …, 2020 | 5 | 2020 |
| PAM-4 based PCIe 6.0 channel design optimization method using Bayesian optimization J Kim, H Park, M Kim, S Kim, S Choi, K Son, J Park, H Kim, J Song, Y Ku, ... 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging …, 2021 | 4 | 2021 |
| Signal integrity analysis of high speed channel considering thermal distribution K Son, S Kim, M Kim, D Lho, K Kim, H Park, G Park, J Kim 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging …, 2021 | 4 | 2021 |
| Analysis of repetitive bending on flexible wireless power transfer (WPT) PCB coils for flexible wearable devices S Jeong, TW Kim, S Lee, B Sim, H Park, K Son, K Son, S Kim, T Shin, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2022 | 3 | 2022 |
| Deterministic policy gradient-based reinforcement learning for DDR5 memory signaling architecture optimization considering signal integrity D Lho, H Park, K Kim, S Kim, B Sim, K Son, K Son, J Kim, S Choi, J Park, ... 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging …, 2022 | 3 | 2022 |
| Signal integrity design and analysis of a spiral through-silicon via (TSV) array channel for high bandwidth memory (HBM) S Kim, T Shin, H Park, D Lho, K Son, K Kim, J Park, S Choi, J Kim, H Kim, ... 2021 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2021 | 3 | 2021 |
| Imitation learning for simultaneous escape routing M Kim, H Park, K Son, S Kim, H Kim, J Kim, J Song, Y Ku, J Park, J Kim 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging …, 2021 | 3 | 2021 |
| Signal integrity analysis of automotive CAN-FD networks with series damping resistor-equipped joint connectors S Park, S Lee, B Sim, K Son, J Kim, J Kim, SW Woo, MS Choi, JJ Lee, ... 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2020 | 3 | 2020 |
| Design and Measurement of a HDMI 2.1 Connector for 8K TV considering Signal Integrity G Park, H Park, D Lho, J Park, K Son, S Kim, T Shin, K Son, J Park, J Kim, ... 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2020 | 3 | 2020 |
| Modeling and Verification of a High Voltage Fuse for High Reliability and Safety in Electric Vehicle S Kim, T Shin, S Jeong, H Kang, K Son, S Park, H Kim, J Choi, M Kim, ... 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2020 | 3 | 2020 |
