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Patrick ChiangProfessor of Electrical and Computer Engineering, Fudan UniversityVerified email at fudan.edu.cn
Nanjian WuInstitute of SemiconductorsVerified email at red.semi.ac.cn
Xi XiaoChina Inform. and Comm. Techn. Group Corporation (CICT);Peng Cheng Laboratory (PCL)Verified email at wri.com.cn
Binhao WangXi'an Institute of Optics and Precision Mechanics, Chinese Academy of SciencesVerified email at opt.ac.cn
Shang HuHuawei TechnologiesVerified email at hisilicon.com
Marco FiorentinoReasearcher, HPE LabsVerified email at hpe.com
Rui BaiOregon State UniversityVerified email at eecs.oregonstate.edu
LI CHENGvisionICsVerified email at evisionics.com
Qiwen LiaoInstitute of Semiconductors, Chinese Academy of SciencesVerified email at semi.ac.cn
Yang XuGraduate Student of Electrical Engineering, Columbia UniversityVerified email at columbia.edu
Kunzhi YuvisionICsVerified email at tamu.edu
Yang XuTexas Instruments; Oregon State University; Tsinghua UniversityVerified email at eecs.oregonstate.edu
Samuel PalermoTexas A&M UniversityVerified email at ece.tamu.edu
Hao LiNvidiaVerified email at nvidia.com
Zhe XuanIntel CorporationVerified email at intel.com
Woogeun RheeProfessor, Tsinghua UniversityVerified email at tsinghua.edu.cn
Jiao ChengMaxim IntegratedVerified email at maximintegrated.com