Design and fabrication of piezoresistive based encapsulated poly-Si cantilevers for bio/chemical sensing NPV Krishna, TRS Murthy, KJ Reddy, K Sangeeth, GM Hegde Physics Procedia 19, 319-324, 2011 | 9 | 2011 |
Enabling transfer of ultrathin layers of GaN for demonstration of a heterogenous stack on copper heat spreader PVK Nittala, N Remesh, S Niranjan, S Tasneem, S Raghavan, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2019 | 6 | 2019 |
Scaling a fluorescent detection system by polymer-assisted 3-D integration of heterogeneous dies PVK Nittala, P Sen Journal of Microelectromechanical Systems 27 (5), 896-909, 2018 | 6 | 2018 |
Characterization and optimization of bonding and interconnect technology for 3D stacking thin dies PVK Nittala, K Haridas, S Nigam, S Tasneem, P Sen Journal of Vacuum Science & Technology B 39 (5), 2021 | 4 | 2021 |
3D die level packaging for hybrid systems NPV Krishna, P Sen 2016 IEEE International Interconnect Technology Conference/Advanced …, 2016 | 4 | 2016 |
Fabrication and characterisation of bulk micromachined ZnO energy transducer with interdigitated electrodes P Chhabra, A Sharma, NPV Krishna Microsystem Technologies 22, 1055-1066, 2016 | 4 | 2016 |
Integration of silicon chip microstructures for in-line microbial cell lysis in soft microfluidics PVK Nittala, A Hohreiter, ER Linhard, R Dohn, S Mishra, A Konda, ... Lab on a Chip 23 (9), 2327-2340, 2023 | 3 | 2023 |
Effect of substrate transfer on performance of vertically stacked ultrathin MOS devices PVK Nittala, K Sahoo, N Bhat, KN Bhat, P Sen IEEE Transactions on Electron Devices 66 (3), 1153-1159, 2019 | 3 | 2019 |
Gallium nitride transistor on glass using epoxy mediated substrate transfer technology NPV Krishna, N Ramesh, N Mohan, R Muralidharan, S Raghavan, ... 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), 1-3, 2017 | 2 | 2017 |
Effect of thermal cycling on electrical properties in 3D die level packaging NPV Krishna, P Sen 2016 3rd International Conference on Emerging Electronics (ICEE), 1-3, 2016 | 2 | 2016 |
Heterogeneous Integration by the 3D Stacking of Thin Silicon Die PVK Nittala, K Haridas, P Sen 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 608-613, 2022 | 1 | 2022 |
Die level 3D heterogeneous integration of a microfluidic system NPV Krishna, P Sen 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), 1-3, 2017 | 1 | 2017 |
Controlled Spalling of Single Crystal 4H-SiC Bulk Substrates CP Horn, C Wicker, A Wellisz, C Zeledon, PVK Nittala, FJ Heremans, ... arXiv preprint arXiv:2404.19716, 2024 | | 2024 |
Controlled Spalling of 4H Silicon Carbide Films for Power Electronics and Quantum Information Science C Horn, A Wellisz, C Wicker, C Zeledon, PVK Nittala, FJ Heremans, ... Bulletin of the American Physical Society, 2024 | | 2024 |
Nanofabrication and Demonstration of a Direct‐Write Microevaporator X Doi, PVK Nittala, B Fu, KZ Latt, S Mishra, L Silverman, L Woodard, ... Small Science 4 (2), 2300121, 2024 | | 2024 |
Nanofabrication and Demonstration of a Direct‐Write Microevaporator PVK Nittala, B Fu, KZ Latt, S Mishra, L Silverman, L Woodard, R Divan, ... Small Science 4 (2), 2023 | | 2023 |
Microfluidic and mems cell lysis system and method B Anindita, A Konda, PVK Nittala, S Guha US Patent App. 18/252,529, 2023 | | 2023 |
3D Packaging for Integration of Heterogeneous Systems PVK Nittala | | 2020 |
MEMS Resonator Filters RM Patrikar Institution of Engineering and Technology, 2020 | | 2020 |