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Son V Nguyen .
Son V Nguyen .
Principle Research Staff, IBM research
Verified email at us.ibm.com
Title
Cited by
Cited by
Year
Structures and methods for integration of ultralow-k dielectrics with improved reliability
SM Gates, S Nguyen
US Patent 7,088,003, 2006
5362006
Multi component dielectric layer
SM Gates, A Grill, S Van Nguyen, SV Nitta
US Patent 8,357,608, 2013
4822013
Method for fabricating an ultralow dielectric constant material as an intralevel or interlevel dielectric in a semiconductor device and electronic device made
SM Gates, A Grill, DR Medeiros, D Neumayer, S Van Nguyen, VV Patel, ...
US Patent 7,049,247, 2006
4492006
SiCOH dielectric
A Afzali-Ardakani, S Gates, A Grill, D Neumayer, S Nguyen, V Patel
US Patent App. 11/336,726, 2007
4472007
PECVD method of depositing fluorine doped oxide using a fluorine precursor containing a glass-forming element
DM Dobuzinsky, T Matsuda, SV Nguyen, JG Ryan, M Shapiro
US Patent 5,563,105, 1996
3141996
Progress in the development and understanding of advanced low k and ultralow k dielectrics for very large-scale integrated interconnects—State of the art
A Grill, SM Gates, TE Ryan, SV Nguyen, D Priyadarshini
Applied Physics Reviews 1 (1), 2014
2942014
C-rich carbon boron nitride dielectric films for use in electronic devices
S Van Nguyen, A Grill, TJ Haigh, S Mehta
US Patent 8,476,743, 2013
2922013
Biogenesis and structure of a type VI secretion membrane core complex
E Durand, VS Nguyen, A Zoued, L Logger, G Pehau-Arnaudet, ...
Nature 523 (7562), 555-560, 2015
2612015
Method of modifying interlayer adhesion
FC Schmitt, LQ Xia, S Van Nguyen, S Venkataraman
US Patent 6,913,992, 2005
2552005
Method for etching boron nitride
SV Nguyen, DM Dobuzinsky
US Patent 5,536,360, 1996
2361996
Plasma-assisted chemical vapor deposition of dielectric thin films for ULSI semiconductor circuits
DR Cote, SV Nguyen, AK Stamper, DS Armbrust, D Tobben, RA Conti, ...
IBM journal of research and development 43 (1.2), 5-38, 1999
2011999
Three-dimensional (3D) integrated circuit with enhanced copper-to-copper bonding
SV Nguyen
US Patent 8,546,956, 2013
1832013
Improving bug detection via context-based code representation learning and attention-based neural networks
Y Li, S Wang, TN Nguyen, S Van Nguyen
Proceedings of the ACM on Programming Languages 3 (OOPSLA), 1-30, 2019
1522019
High-density plasma chemical vapor deposition of silicon-based dielectric films for integrated circuits
SV Nguyen
IBM Journal of Research and development 43 (1.2), 109-126, 1999
1351999
Effects of titanium nanotubes on the osseointegration, cell differentiation, mineralisation and antibacterial properties of orthopaedic implant surfaces
EP Su, DF Justin, CR Pratt, VK Sarin, VS Nguyen, S Oh, S Jin
The bone & joint journal 100 (1_Supple_A), 9-16, 2018
1272018
Low K and ultra low K SiCOH dielectric films and methods to form the same
SM Gates, CD Dimitrakopoulos, A Grill, S Van Nguyen
US Patent 7,282,458, 2007
1242007
Plasma assisted chemical vapor deposited thin films for microelectronic applications
SV Nguyen
Journal of Vacuum Science & Technology B: Microelectronics Processing and …, 1986
1241986
Reaction Mechanisms of Plasma‐and Thermal‐Assisted Chemical Vapor Deposition of Tetraethylorthosilicate Oxide Films
S Nguyen, D Dobuzinsky, D Harmon, R Gleason, S Fridmann
Journal of The Electrochemical Society 137 (7), 2209, 1990
1171990
Low temperature plasma oxidation process
DM Dobuzinsky, DL Harmon, SR Kasi, DM Kenney, S Van Nguyen, ...
US Patent 5,330,935, 1994
1161994
The variation of physical properties of plasma‐deposited silicon nitride and oxynitride with their compositions
VS Nguyen, S Burton, P Pan
Journal of The Electrochemical Society 131 (10), 2348, 1984
1051984
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