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| Aircraft failure detection and identification using neural networks MR Napolitano, CI Chen, S Naylor Journal of Guidance, Control, and Dynamics 16 (6), 999-1009, 1993 | 113 | 1993 |
| PRACTICAL EVALUATION FOR LONG‐TERM STABILITY OF THERMAL INTERFACE MATERIAL CI Chen, CY Ni, HY Pan, CM Chang, DS Liu Experimental Techniques 33 (1), 28-32, 2009 | 19 | 2009 |
| 蔡国忠 陈精一 电脑辅助工程分析 ANSYS 使用指南, 2001 | 17 | 2001 |
| Thermal characterization of thermal interface materials CI Chen, CY Ni, CM Chang, DS Liu, HY Pan, TD Yuan Experimental Techniques 32 (3), 48-52, 2008 | 14 | 2008 |
| Flexible rotating beam: comparative modelling of isotropic and composite material including geometric non-linearity CI Chen, VH Mucino, CC Spyrakos Journal of sound and vibration 178 (5), 591-605, 1994 | 14 | 1994 |
| Adaptable resilient pin assembly for BGA based IC encapsulation WF Fan, WC Chou, CY Chen US Patent 6,866,519, 2005 | 12 | 2005 |
| A new learning algorithm for neural network state estimation in active vibration control CI Chen, MR Napolitano, CL Chen Smart Materials and Structures 1 (3), 250, 1992 | 12 | 1992 |
| Bondability Study of Chip-on-Film (COF) Inner Lead Bonding (ILB) Using Conventional Gang Bonder 10. Ching-I. Chen, Ching-Yu Ni, Chi-Min Chang, Shao-Chiun Wu and De-Shin Liu IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING 31 (4), 285-290, 2008 | 11 | 2008 |
| Recipe optimization and design software development of tape carrier package (TCP) inner lead bonding (ILB) CY Ni, KS Yoon, HJ Ahn, CI Chen IEEE transactions on electronics packaging manufacturing 28 (2), 150-157, 2005 | 9 | 2005 |
| Mechanical Characterization and Performance Optimization for GPU Fan-Sink Cooling Module Assembly TDY Ching-I Chen, Ching-Yu Ni, Cheng-Chung Lee, Hsin-Yu Pan IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING 30 (3), 173-180, 2007 | 6 | 2007 |
| ANSYS 7.0 電腦輔助工程實務分析 陳精一 | 5 | 2004 |
| An accommodative approach designed for TCP gold-to-gold inner lead bonding CY Ni, CI Chen, KS Yoon, HJ Ahn IEEE transactions on electronics packaging manufacturing 29 (2), 91-98, 2006 | 3 | 2006 |
| ANSYS 振動學實務分析 陳精一 | 3 | 2005 |
| Global-to-Local Modeling and Experiment Investigation of a HFCBGA Package Board-level Solder Joint Reliability CYNTDY C.I. Chen, S.C. Wu, D.S. Liu Journal of Microelectronics and Electronic Packaging 4 (4), 186-194, 2007 | 2 | 2007 |
| 电脑辅助工程分析 ANsYs 使用指南 fM E 京: 中国铁道出版社 陈精一， 蔡国忠 2o∞. 网刘永志珠刚. 李海梅, 申长雨基于材料边界的挤出温度场数值模拟们 _ 中国 …, 2005 | 2 | 2005 |
| ANSYS 软件工程分析使用指南 陈精一， 蔡国忠 北京: 铁道出版社, 2001 | 2 | 2001 |
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| 電腦輔助工程分析 蔡國忠， 陳精一 全華出版社, 2001 | 1 | 2001 |
| 電腦輔助工程分析-ANSYS 使用指南 陳精一， 蔡國忠 台北市: 全華圖書公司, 2000 | 1 | 2000 |
