| Reliability of emerging bonded interface materials for large-area attachments PP Paret, DJ DeVoto, S Narumanchi IEEE Transactions on Components, Packaging and Manufacturing Technology 6 (1 …, 2015 | 25 | 2015 |
| Transient liquid phase bonding of AlN to AlSiC for durable power electronic packages DG Pahinkar, W Puckett, S Graham, L Boteler, D Ibitayo, S Narumanchi, ... Advanced Engineering Materials 20 (10), 1800039, 2018 | 24 | 2018 |
| Degradation characterization of thermal interface greases D DeVoto, J Major, P Paret, GS Blackman, A Wong, JS Meth 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2017 | 18 | 2017 |
| Stress intensity of delamination in a sintered-silver interconnection DJ DeVoto, PP Paret, AA Wereszczak Additional Papers and Presentations 2014 (HITEC), 000190-000197, 2014 | 16 | 2014 |
| Thermal and thermomechanical modeling to design a gallium oxide power electronics package P Paret, G Moreno, B Kekelia, R Kotecha, X Feng, K Bennion, B Mather, ... 2018 IEEE 6th workshop on wide bandgap power devices and applications (WiPDA …, 2018 | 15 | 2018 |
| Ultracompliant heterogeneous copper–tin nanowire arrays making a supersolder W Gong, P Li, Y Zhang, X Feng, J Major, D DeVoto, P Paret, C King, ... Nano letters 18 (6), 3586-3592, 2018 | 15 | 2018 |
| Packaging of an 8-kV silicon carbide diode module with double-side cooling and sintered-silver joints Z Zhang, J Zhang, J Xu, KDT Ngo, GQ Lu, E Cousineau, P Paret, ... 2021 IEEE Electric Ship Technologies Symposium (ESTS), 1-7, 2021 | 14 | 2021 |
| Liquid-cooled aluminum silicon carbide heat sinks for reliable power electronics packages DG Pahinkar, L Boteler, D Ibitayo, S Narumanchi, P Paret, D DeVoto, ... Journal of Electronic Packaging 141 (4), 041001, 2019 | 14 | 2019 |
| Thermal performance and reliability characterization of bonded interface materials (BIMs) D DeVoto, P Paret, M Mihalic, S Narumanchi, A Bar-Cohen, K Matin Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014 | 14 | 2014 |
| Reliability and lifetime prediction model of sintered silver under high-temperature cycling P Paret, J Major, D DeVoto, S Narumanchi, C Ding, GQ Lu IEEE Journal of Emerging and Selected Topics in Power Electronics 10 (5 …, 2021 | 13 | 2021 |
| Reliability of bonded interfaces for automotive power electronics D DeVoto, P Paret, S Narumanchi, M Mihalic International Electronic Packaging Technical Conference and Exhibition 55751 …, 2013 | 13 | 2013 |
| Evaluation of low-pressure-sintered multi-layer substrates for medium-voltage SiC power modules J Gersh, C DiMarino, D DeVoto, P Paret, J Major, S Gage 2021 IEEE Applied Power Electronics Conference and Exposition (APEC), 20-26, 2021 | 10 | 2021 |
| Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities P Paret, D Finegan, S Narumanchi Journal of Electronic Packaging 145 (3), 034501, 2023 | 9 | 2023 |
| Power electronics thermal solutions using thermally conductive polyimide films R Tripathi, S Im, D Devoto, J Major, S Narumanchi, P Paret, X Feng Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT) 2019 (DPC …, 2019 | 6 | 2019 |
| Thermomechanical modeling of high-temperature bonded interface materials PP Paret, DJ DeVoto, SVJ Narumanchi Die-Attach Materials for High Temperature Applications in Microelectronics …, 2019 | 5 | 2019 |
| Method to determine maximum allowable sinterable silver interconnect size AA Wereszczak, MC Modugno, SB Waters, DJ DeVoto, PP Paret Additional Papers and Presentations 2016 (HiTEC), 000207-000215, 2016 | 5 | 2016 |
| Performance and Reliability of Interface Materials for Automotive Power Electronics (Presentation) S Narumanchi, D DeVoto, M Mihalic, P Paret National Renewable Energy Lab.(NREL), Golden, CO (United States), 2013 | 5 | 2013 |
| Electrothermal modeling and analysis of gallium oxide power switching devices RM Kotecha, A Zakutayev, WK Metzger, P Paret, G Moreno, B Kekelia, ... International Electronic Packaging Technical Conference and Exhibition 59322 …, 2019 | 4 | 2019 |
| PCB-on-DBC GaN Power Module Design with High-Density Integration and Double-Sided Cooling X Tian, N Jia, D DeVoto, P Paret, H Bai, LM Tolbert, H Cui IEEE Transactions on Power Electronics, 2023 | 3 | 2023 |
| Jet impingement manifolds for cooling power electronics modules G Moreno, SVJ Narumanchi, KS Bennion, RM Kotecha, PP Paret, F Xuhui US Patent 11,751,365, 2023 | 3 | 2023 |
Sreekant NarumanchiNational Renewable Energy LaboratoryVerified email at nrel.gov
